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Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

Large Image :  Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF180-05S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook Thickness: 2mmT
Thermal Conductivity: 1.5W/m-K Construction & Compostion: Ceramic Filled Silicone Rubber
Color: Light Blue Sample: Sample Free
Keywords: Thermal Pad Application: GPU Desktop Notebook
Highlight:

thermally conductive pad

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thermal conductive material

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1.5 W thermal conductive adhesive pads

Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook

 

The TIF180-05S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook 0
Features:
>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

>  RoHS compliant and UL recognized


Applications:
>  CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

 
Typical Properties of TIF180-05S Series
Color Blue Visual
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.3g/cc ASTM D297
Hardness 45 Shore 00 ASTM 2240
Thickness range 0.020"(0.5mm)~0.200“(5.0mm) ASTM D412
Continuos Use Temp -45 to 200℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-cm ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.5W/m-K ASTM D5470

 

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:    
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:    
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
TIF™ series sheets type can add with fiberglass reinforced.
Heat Transfer Silicone Pad Thermal Pads Gap Filling Materials GPU Desktop Notebook 1

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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