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High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

Large Image :  High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-60-06S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: TT
Supply Ability: 10000/day
Detailed Product Description
Product Name: High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness1.0mm Thermal Pad For Graphics Card Thermal Module Thermal Conductivity: 6.0W/m-K
Density: 3.4 G/cm³ Color: White
Hardness(Shore 00): 45 Materials: Ceramic Filled Silicone Elastomer
Operating Temp: -40~200℃ Keywords: Thermal Pad
Application: Graphics Card Thermal Module
Highlight:

6.2W thermal gap filler pad

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thermal gap filler pad 1mmT

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45shore00 thermal gap filler pad

High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module

 

The TIF®140-60-06S thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:


>  Good thermal conductive: 6.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

>  Easy release construction
>  Electrically isolating
>  High durability


Applications:


> Cooling components to the chassis of frame  
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
>  Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

 

Typical Properties of TIF®100-60-06S Series
Property Value Test method
Color White Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.020~0.200 ASTM D374
0.50mm~5.0mm
Hardness 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity ≥1.0X1012 Ohm-meter ASTM D257
Flame rating 94-V-0 UL E331100
Thermal conductivity 6.0 W/m-K ASTM D5470
6.0 W/m-K ISO22007

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Thermal Conductivity 6.0W Thermal Gap Filler Pad Thickness 1.0mm Thermal Pad For Graphics Card Thermal Module 0

Company profile

 

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

 

Thermal gap pad

 

Thermal graphite sheet/film

 

Thermal double-sided tape

 

Thermal insulation pad

 

Thermal grease

 

Phase change material

 

Thermal gel

 

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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