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2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems

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2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems

2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems
2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems
2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems 2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems 2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems

Large Image :  2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-20-02S
Document: TIF100-20-02S_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
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2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems

Description
Products Name: 2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems Thermal Conductivity& Compostion: 2.0W/m-K
Density: 2.65 G/cm³ Keywords: Thermal Conductive Pad
Color: Gray White Recommended Operating Temperature (℃)): -40 To 200
Hardness: 65/45 Shore 00 Application: For Heat Transfer In Electronic Cooling Systems
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2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems
 
The TIF®140-20-02S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features:
 
>  Good thermal conductive: 2.0W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness
 
Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)
 


Typical Properties of TIF®100-20-02S Series
Property Value Test method
Color

Gray white

 Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.65 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness(Shore 00) 65 45 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1Mhz 4.7 ASTM D150
Volume Resistivity(Ohm-cm) ＞1.0X1012  ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
2.0 ISO22007
Fire rating V-0 UL 94 (E331100)

 

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.


Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
 
Packaging Details & Lead time
 
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
 
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

 
2.0W/mK Thermal Conductive Pad Soft Compressible And Naturally Adhesive Material For Heat Transfer In Electronic Cooling Systems 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer
6.Quality assurance contract
 

FAQ:


Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
 
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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