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Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking

Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking
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Large Image :  Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™100-10E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Heat Capacity: 1 L/g-K Thermal Conductivity: 1.5 W/m-K
Hardness: 35 Shore 00 Specific Gravity: 2.95 G/cc
Continuos Use Temp: -50 To 200℃ Outgassing(TML): 0.30%
High Light:

thermally conductive pad

,

thermal conductive material

Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking

 

     The TIF™100-10E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. 


Features


> Good thermal conductive: 1.5 W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications


> Cpu heat sinking 
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

 

Typical Properties of TIF™100-10E Series
Color
Gray 
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.95 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Heat Capacity
1 l/g-K
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
35 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.30%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-50 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>10000 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
4.2X1012
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 
Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking 0
 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)