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Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs

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Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs

Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs
Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs
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Large Image :  Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs

Product Details:
Place of Origin: Dongguan
Brand Name: Ziitek
Certification: RoHs UL
Model Number: TIF180-30-11E
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Packaging Details: 1000pcs/Bag
Supply Ability: 10000PCS/days
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Detailed Product Description
Product Name: Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs Color: Gray
Hardness: 35 Shore 00 Specific Gravity: 3.0g/cc
Thickness: 2mmT Dielectric Breakdown Voltage: >5500 VAC
Thermal Conductivity: 3.0W/mK Keywords: Silicone Thermal Pad
Sample: Sample Free Application: Advanced Cooling Needs
Highlight:

thermally conductive pad

,

thermal conductive material

,

2mmT thermal conductive adhesive pad

Premium Soft 3.0W Thermal Conductivity Silicone Thermal Pad With Adhesive For Advanced Cooling Needs

 

Ziitek thermal conductive interface materials are widely recognized and trusted by users and can meet continuously developing economic and social needs.Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.
 
The TIF®180-30-11E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.


Features

 

> Good thermal conductive: 3.0W/mK

> Naturally tacky needing no further adhesive coating
> Available in varies thickness
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
 
Applications


> PCB/CPU/LED
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Routers

Typical Properties of TIF®180-30-11E Series
Color
 Gray Visual
Construction & Compostion

 Ceramic filled silicone elastomer

 ******
Thickness range 0.02"(0.5mm)~0.200"(5.0mm) ASTM D374
Specific Gravity
 3.0 g/cc ASTM D297
Hardness
 35 Shore 00 ASTM 2240
Continuos Use Temp
 -45 to 200℃ ******
Dielectric Breakdown Voltage
 >5500 VAC ASTM D149
Dielectric Constant
 5.0 MHz ASTM D150
Volume Resistivity
 1.0X1012 Ohm-meter ASTM D257
Fire rating 
 94 V0 equivalent UL
Outgassing 0.40% ASTM E595
Thermal conductivity
 3.0W/m-K ASTM D5470
 

Products specification

 

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individua de cut shapes and custom thickness can be supplied. Please contact us for confirming


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF series sheets type can add with fiberglass reinforced.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charg.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)

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