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Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

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Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

Large Image : Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	RoHs
Model Number:	TIG780-20

Payment & Shipping Terms:

Minimum Order Quantity:	1KG
Packaging Details:	1KG/CAN
Delivery Time:	3-5 work days
Supply Ability:	100KG/Days

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Detailed Product Description

Product Name:	TIG780-20	Color:	White
Construction & Compostion:	Metal Oxide Filled Silicone Oil	Thermal Conductivity:	2.0 W/mK
Evaporation:	0.15% / 200℃@24hrs	Viscosity:	2300K Cps @.25℃
Highlight:	thermally conductive grease , cpu thermal paste , Thermoelectric Cooling Thermal Conductive Grease

Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK -49℉ - 392℉

The TIG™780-20 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.

Features

Low thermal resistance

One component paste like interface material, never dry

Thermal compound formulated to maximize the heat transfer

Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures

Non-toxic and environmentally safe

Silicone-based materials conduct heat between a hot component and a heat sink or enclosure

Fills interface variable tolerances in electronics assemblies and heat sink applications

Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration

Thermally stable and require virtually no compressive force to deform under typical assembly pressures

Supports high power applications requiring material with minimum bond line thickness and high conductivity

Ideal for rework and field repair situations

Low bleed and evaporation

Applications

Semiconductor cases and heat sinks

Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices

CPUs and GPUs

Automatic dispensing and screen-printing

Mobile, desktop

Engine and transmission control modules

Memory modules

Power conversion equipment

Power supplies and UPS

Power semiconductors

Custom ASICS Chips

Integrated Gate Bipolar Transistors (IGBT)

Between any heat generating semiconductor and heat sink

Custom power modules

Telecommunications and automotive electronics

LED Power Supply

LED Controller

LED Lights

LED Ceilinglamp

Typical Properties of TIG™780-20 Series
ProductName	TIG^TM780-20	Test Method
Color	White paste	Visual
Construction & Compostion	Metal oxide filled silicone oil
Viscosity	1800K cps @.25℃	Brookfield RVF,#7
Specific Gravity	2.5 g/cm3
Continuous Use Temp	-49℉ to 392℉ / -45℃ to 200℃	*****
Evaporation	0.15% / 200℃@24hrs	*****
Thermal Conductivity	2.0 W/mK	ASTM D5470
Thermal lmpedance	0.05℃-in²/W @ 50 psi(344 KPa)	ASTM D5469

Package:
TIG™780 series is available in 1kg (pint container), 3kg (quart container), and 10kg (gallon container) or custom packaged in syringes for automated applications.

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Contact Person: Dana Dai

Tel: 18153789196

Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

Thermoelectric Cooling Silicone Thermal Conductive Grease with 2 W / mK, -49℉ - 392℉

thermally conductive grease

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Thermoelectric Cooling Thermal Conductive Grease

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