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—— Peter Goolsby
—— Antonello Sau
—— Chris Rogers
Ziitek company will exhibit thermal conductive materials in Vietnam CEIT in 10-12, July
Ziitek Electronical Material and Technology Ltd. will attend the 2024 Vietnam Consumer Electronics and Information Technology Exhibition CEIT, below is the information:
Date: 2024.07.10~12
Booth No. : A3-C82
Venue: Ho Chi Minh Saigon Convention and Exhibition Center
We sincerely invite you come to visit and inquiry thermal conductive materials for your electronics.
Ultra Soft Thermal Gap Filler TIF4120 For Telecommunication Hardware
Highest Thermal Gap Filler , Thermal Conductive Pad For Electronics Heat Transfer
Grey Color Thermal Gap Filler Pads TIF8120 For Wireless Routers Applicated
1.25w / m.k Thermally Conductivity Gap Filler / Thermal Insulation Pad
TIR300CU Copper Composite Carbon Nano Coating thermal graphite sheet
Black Natural Thermal Graphite Sheet 10.0W/m-K for Power conversion equipment
3.0W / mK PA6 Light Insulation Engineering white Thermal Conductive Plastic for LED Radiator
Led Lamps Black Thermal Conductive Plastic Housing 5 W / mK with 1.45g / cm Specific Gravity