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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape For Heatsink Cooling 0.9 W/mK

0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK
0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK 0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK 0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK 0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK

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Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA810
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
Detailed Product Description
Thickness: 0.1mmT~0.5mmT Adhesive Type: Acrylic Adhesive
Thermal Conductivity: 0.9 W/mK Voltage Breakdown: > 5000 Vac
High Light:

thermally conductive adhesive tape

,

acrylic adhesive tape

The TIA™810 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


Features

 

Thermal Conductivity 0.9W/mK.
High bond strength to a variety of surfaces
Double sided pressure sensitive adhesive tape.
High performance, thermally conductive acrylic adhesive
allow for good conformability to irregular surfaces and good electrical isolation
Easy Application
Eliminates need for external hardware (screws, clips, etc.)
Available with easy release tabs

 

Applications

 

Mount heat sink onto BGA graphic processor or drive processor.
Mount heat spreader onto power converter PCB or onto motor control PCB
Can be used instead of heat cure adhesive,screw mounting or clip mounting
Heat sink onto BGA graphic processor
Heat sink to computer processor
Heat sink onto drive processor
LED Power Supply
LED Controller
LED Lights
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters
Rainproof LED Power Supply
Waterproof LED Power Supply
Piranha wroof and common lED module
LED module for Channelletters
SMD LED module
LED Flesible strip, LED bar
LED PanelLight

 

Typical Properties of TIA™800 Series
Product Name TIA™806 TIA™808 TIA™810 TIA™812 TIA™818 Test Method
Color White White White White White Visual
Construction
&Compostion
Ceramic filled silicone elastomer ***
Composite Thickness 0.006"/0.152mm 0.008"/0.203mm 0.010"/0.254mm 0.012"/0.304mm 0.018"/0.457mm ASTM D751
Specific Gravity 2.2 g/cc ASTM D297
Specific Gravity 1 l/g-K ASTM C351
Hardness 50 Shore A ASTM 2240
Tensile Strength 450 psi >600 psi >600 psi >600 psi >600 psi ASTM D412
Continuous Use Temp (-58 to 356℉) / (-50 to 180℃) ***
Electrical  
Dielectric Breakdown Voltage >1500 VAC >3500 VAC >5000 VAC >5000 VAC >5000 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 5.0X10" Ohm-meter ASTM D257
Flame Rating 94 V0 equivalent UL
Thermal  
Thermal Conductivity 0.9 W/m-K ASTM D5470
Thermal lmpedance @50psi 0.21℃-in²/W 0.35℃-in²/W 0.82℃-in²/W 1.23℃-in²/W 1.83℃-in²/W ASTM D5471
 
0.5mm High Dielectric Strength 2.2 g/cc Thermally Adhesive Tape  For Heatsink Cooling 0.9 W/mK 0
 
 
Standard Thicknesses:

0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.

Standard Sizes:

10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.

Reinforcement:

TIA™800 Series sheets are fiberglass reinforced.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)