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Product Details:
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| Product Name: | Thermal Management Solution Excellent Thermal Conductivity Thermal Pad For AI Servers And Power Electronics | Composition: | Ceramic Filled Silicone Elastomer |
|---|---|---|---|
| Breakdown Strength(V/mm): | ≥4500 | Application: | AI Servers And Power Electronics |
| Sample: | Sample Free | Recommended Operating Temperature (°C): | -40 To 200℃ |
| Thermal Conductivity(W/mk): | 13.0W/mK | Hardness (Shore Oo): | 25/10 |
| Flame Rating: | UL 94 V-0 | Keywords: | Thermal Pad |
| Highlight: | Thermal Pad for AI Servers,Thermal Gap Filler Power Electronics,High Conductivity Thermal Pad |
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The TIF®800QU Series is an ultra-soft thermal interface material, specially designed to protect precision components that are extremely sensitive to mechanical stress. This product combines ultra-high thermal conductivity with extreme gel-like softness, adapting to various uneven heat dissipation interfaces, compensating for assembly tolerances, minimizing air thermal resistance, and efficiently dissipating heat while providing comprehensive protection for chips, sensors, and optoelectronic devices. It is the preferred solution for heat dissipation and protection in precision electronics.
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 3.45 | ASTM D792 |
| Thickness Range (inch/mm) | 0.020~0.200 / 0.50~5.00 | ASTM D374 |
| Hardness (Shore 00) (3 Second / 30 Second) | 25 / 10 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥4500 | ASTM D149 |
| Volume Resistivity (Ohm-meter) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 13.0 | ASTM D5470 |
| Dielectric Constant @1MHz | 7.5 | ISO 22007 |
Standard Thickness: 0.020" (0.50 mm) – 0.200" (5.00 mm), with increments of 0.010" (0.25 mm).
Standard Size: 16" × 16" (406 mm × 406 mm).
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high-performance thermal products including:
All products are compliant with UL94 V-0, SGS, and RoHS standards.
Q: What is a Thermal Silicone Pad?
A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.
Q: What are the advantages of Thermal Silicone Pads?
A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
Q: Is a thinner Thermal Silicone Pad always better?
A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
Q: What are the common thicknesses of Thermal Silicone Pads?
A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.
Contact Person: Dana Dai
Tel: +86 18153789196
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