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Product Details:
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| Product Name: | Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components | Construction: | Ceramic Filled Silicone Elastomer |
|---|---|---|---|
| Breakdown Strength(V/mm): | ≥5500 | Application: | Semiconductor Microwave Components |
| Sample: | Sample Free | Recommended Operating Temperature (°C): | -40 To 200℃ |
| Thermal Conductivity(W/mk): | 1.5W/mK | Hardness(Shore Oo): | 65/35 |
| Flame Rating: | UL 94 V-0 | Keywords: | Thermally Conductive Gap Filler Pads |
| Highlight: | Low Dielectric Thermally Conductive Gap Filler Pads,Soft Thermally Conductive Gap Filler Pads,Thermal Gap Filler for Semiconductor Microwave Components |
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The TIF®100N-15-16E Series is a low-dielectric thermal pad — a flexible thermal insulation material developed for high-frequency, high-integration, and signal-sensitive electronic devices. It provides excellent thermal conductivity while maintaining low-dielectric electrical properties.
This balanced design combines good surface fit with excellent operational convenience, taking into account both effective heat dissipation and low-dielectric performance. It meets the dual requirements of thermal management and signal transmission for precision electronic devices, with stable performance and strong practicality.
| Property | Value | Test Method |
|---|---|---|
| Color | Purple | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | — |
| Density (g/cm³) | 1.5 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 / 0.25~0.50 | 0.030~0.200 / 0.75~5.00 | ASTM D374 |
| Hardness (Shore 00) | 65 | 35 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | — |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Volume Resistivity (Ohm-meter) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 1.5 | ASTM D5470 |
| Thermal Conductivity (W/m-K) | 1.5 | ISO 22007 |
Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm), with increments of 0.010" (0.25 mm).
Standard Size: 16" × 16" (406 mm × 406 mm).
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Quantity (Pieces): 5000
Estimated Time (days): To be negotiated
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high-performance thermal products including:
All products are compliant with UL94 V-0, SGS, and RoHS standards.
A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.
A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.
Contact Person: Dana Dai
Tel: +86 18153789196
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