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Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components
Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100N-15-16E
Document: TIF100N-15-16E_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 10000/day

Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components

Description
Product Name: Excellent Softness Low Dielectric Thermally Conductive Gap Filler Pads For Semiconductor Microwave Components Construction: Ceramic Filled Silicone Elastomer
Breakdown Strength(V/mm): ≥5500 Application: Semiconductor Microwave Components
Sample: Sample Free Recommended Operating Temperature (°C): -40 To 200℃
Thermal Conductivity(W/mk): 1.5W/mK Hardness(Shore Oo): 65/35
Flame Rating: UL 94 V-0 Keywords: Thermally Conductive Gap Filler Pads
Highlight:

Low Dielectric Thermally Conductive Gap Filler Pads

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Soft Thermally Conductive Gap Filler Pads

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Thermal Gap Filler for Semiconductor Microwave Components

Product Overview

The TIF®100N-15-16E Series is a low-dielectric thermal pad — a flexible thermal insulation material developed for high-frequency, high-integration, and signal-sensitive electronic devices. It provides excellent thermal conductivity while maintaining low-dielectric electrical properties.

This balanced design combines good surface fit with excellent operational convenience, taking into account both effective heat dissipation and low-dielectric performance. It meets the dual requirements of thermal management and signal transmission for precision electronic devices, with stable performance and strong practicality.


Key Features
  • Good thermal conductivity
  • Excellent softness and fillability
  • Self-adhesive without the need for additional surface adhesive
  • Highly compressible, easy to install and operate
  • Low dielectric constant effectively reduces signal loss

Applications
  • Millimeter wave radar
  • Semiconductor microwave components
  • 5G base station
  • RF power amplifier
  • High performance computing / server memory

Typical Properties of TIF®100N-15-16E Series
Property Value Test Method
Color Purple Visual
Construction & Composition Ceramic filled silicone elastomer —
Density (g/cm³) 1.5 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 / 0.25~0.50  |  0.030~0.200 / 0.75~5.00 ASTM D374
Hardness (Shore 00) 65  |  35 ASTM 2240
Recommended Operating Temperature -40 to 200°C —
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
Thermal Conductivity (W/m-K) 1.5 ISO 22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16" × 16" (406 mm × 406 mm).

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.


Packaging & Lead Time
TIF series thermal pad packaging showing PET film protection, paper card layer separation, and export carton
Packaging Details
  1. With PET film or foam for protection
  2. Use paper card to separate each layer
  3. Export carton inside and outside
  4. Meet customers' requirements — customized
Lead Time

Quantity (Pieces): 5000

Estimated Time (days): To be negotiated


Company Profile

Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high-performance thermal products including:

All products are compliant with UL94 V-0, SGS, and RoHS standards.

Certifications
  • ISO 9001:2015
  • ISO 14001:2004
  • IATF 16949:2016
  • IECQ QC 080000:2017
  • UL

How to Place an Order
  1. Click the "Sent messages" button to continue with the process.
  2. Fill out the message form by entering a subject line and your message to us. This message should include any questions you might have about the products as well as your purchase requests.
  3. Click the "Send" button when you are finished to complete the process and send your message to us.
  4. We will reply to you as soon as possible via email or online.

Frequently Asked Questions
Q: What is a Thermal Silicone Pad?

A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

Q: What are the advantages of Thermal Silicone Pads?

A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Q: Is a thinner Thermal Silicone Pad always better?

A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Q: What are the common thicknesses of Thermal Silicone Pads?

A: Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
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2 stars
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All Reviews

D
Dante
Poland Jul 20.2026
These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.
Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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