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Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack

Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack
Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack

Large Image :  Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF200-20-18U
Document: TIF200-20-18U_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 100000pcs/day

Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack

Description
Products Name: Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack Hardness: 70/27 Shore 00
Keywords: Thermal GAP PAD Materials Thermal Conductivity: 2.0W/m-K
Color: Yellow/ Green Continuous Use Temp: -40 To 200℃
Sample: Sample Free Thickness: 0.010"(0.25mm)~0.200"(5.0mm)
Application: Advanced Cooling Needs, EV And Battery Pack
Highlight:

silicone thermal gap pad

,

2.0W/MK thermal filler

,

high-performance cooling gap pad

Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack
Product Overview

The TIF®200-20-18U Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation, such as power devices, new energy vehicles, and portable electronic devices.

Key Features
  • Good thermal conductivity
  • Super soft and highly compliant
  • Self-adhesive without the need for additional surface adhesives
  • High insulation performance
  • Puncture-resistant, tear-resistant, and scratch-resistant performance
Applications
  • Power Electronics
  • Automotive Electronics
  • Consumer Electronics
  • Industrial Control
  • New Energy
Technical Specifications of TIF®200-20-18U Series
Property Value Test Method
Color Yellow/Green Visual
Construction & Composition Ceramic filled silicone elastomer -
Density (g/cm³) 2.5 ASTM D792
Thickness Range (inch/mm) 0.010"~0.200" / 0.25~5.00mm ASTM D374
Hardness (Shore00) 70±27 ASTM 2240
Continuous Use Temp -40 to 200℃ -
Breakdown Strength (V/mm) ≥ 5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470 / ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Thermal Gap Pad Material Product Image
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: 5000 pieces - Estimated time to be negotiated

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc.

Factory Details:

Factory Size: 8,000~10,000 square meters

Location: No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Online Service: 12 hours, Inquiry reply within fastest

Working Time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)

Well-trained & experienced staff available to answer all inquiries in English

Standard Export Carton or customized packaging available

Free samples provided

After-service: Even our products have passed strict inspection, if you find the parts cannot work well, please show us the proof. We will help you to deal with it and give you satisfactory solution.

Visit our website: www.thermalconductivematerials.com

Thermal Conductivity Materials Manufacturing Facility

Overall Rating

5.0
Based on 50 reviews for this supplier

Rating Snapshot

The following is the distribution of all ratings
5 stars
100%
4 stars
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3 stars
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All Reviews

D
Dante
Poland Jul 20.2026
These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.
Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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