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Product Details:
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| Products Name: | Thermal Gap Pad Materials 2.0W/MK Silicone-Based Thermal Gap Pad For EV And Battery Pack | Hardness: | 70/27 Shore 00 |
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| Keywords: | Thermal GAP PAD Materials | Thermal Conductivity: | 2.0W/m-K |
| Color: | Yellow/ Green | Continuous Use Temp: | -40 To 200℃ |
| Sample: | Sample Free | Thickness: | 0.010"(0.25mm)~0.200"(5.0mm) |
| Application: | Advanced Cooling Needs, EV And Battery Pack | ||
| Highlight: | silicone thermal gap pad,2.0W/MK thermal filler,high-performance cooling gap pad |
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The TIF®200-20-18U Series is a compound thermal interface material that combines good thermal conductivity, reliable electrical insulation, and extremely soft characteristics. This product not only provides excellent thermal conductivity but also ensures superior breakdown voltage strength, effectively preventing circuit short circuits. Its soft characteristic allows it to fully fill uneven interfaces, providing excellent cushioning protection for precision components while dissipating heat. This series is an ideal choice for applications requiring electrical isolation, such as power devices, new energy vehicles, and portable electronic devices.
| Property | Value | Test Method |
|---|---|---|
| Color | Yellow/Green | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | - |
| Density (g/cm³) | 2.5 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010"~0.200" / 0.25~5.00mm | ASTM D374 |
| Hardness (Shore00) | 70±27 | ASTM 2240 |
| Continuous Use Temp | -40 to 200℃ | - |
| Breakdown Strength (V/mm) | ≥ 5500 | ASTM D149 |
| Dielectric Constant @1MHz | 5.0 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | >1.0×10¹² | ASTM D257 |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 / ISO22007 |
| Fire Rating | V-0 | UL 94 (E331100) |
Standard Thickness: 0.010" (0.25 mm)~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm ×406 mm)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Packaging Details:
Lead Time: 5000 pieces - Estimated time to be negotiated
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc.
Factory Details:
Factory Size: 8,000~10,000 square meters
Location: No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Online Service: 12 hours, Inquiry reply within fastest
Working Time: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
Well-trained & experienced staff available to answer all inquiries in English
Standard Export Carton or customized packaging available
Free samples provided
After-service: Even our products have passed strict inspection, if you find the parts cannot work well, please show us the proof. We will help you to deal with it and give you satisfactory solution.
Visit our website: www.thermalconductivematerials.com
Contact Person: Dana Dai
Tel: +86 18153789196
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