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Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad
Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad
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Large Image :  Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TS-TIF 100C 6050-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Self-Adhesive Thermal Gap Pad 0.3mm To 5.0mm Thick 6.0W/M·K Silicone Thermal Pad Hardness: 50 Shore 00
Color: Gray Thermal Conductivity& Compostion: 6.0W/m-K
Specific Gravity: 3.3g/cc Thickness: 0.012"(0.30mm)~0.200"(5.00mm)
Construction: Ceramic Filled Silicone Elastomer Continuos Use Temp: -45℃ To 200℃
Application: Laptop Heatsink CPU GPU SSD IC LED Cooler Keywords: Silicone Thermal Pads
Highlight:

0.3mm Thermal Gap Pad

,

6.0W/M·K Thermal Gap Pad

,

5.0mm Thermal Gap Pad

Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad

 

TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:
> Excellent thermal conductivity 5.0W/mK

> Self-adhesive without the need for additional surface adhesive
> Naturally tacky needing no further adhesive coating
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications:

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

Typical Properties of  TS-TIF®100C 6050-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 50 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 7.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 6.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
Self-Adhesive Thermal Gap Pad 0.3mm to 5.0mm Thick 6.0W/M·K Silicone Thermal Pad 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)