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6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery
6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery
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Large Image :  6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100C 6050-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: 6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery Keywords: Thermal Gap Filler
Color: Gray Thermal Conductivity& Compostion: 6.0W/m-K
Specific Gravity: 3.3g/cc Thickness: 0.012"(0.30mm)~0.200"(5.00mm)
Construction: Ceramic Filled Silicone Elastomer Continuos Use Temp: -45℃ To 200℃
Application: LED CPU GPU EV Battery Hardness: 50 Shore 00
Highlight:

6.0W Thermal Gap Filler Pad

,

Self-Adhesive Thermal Gap Filler Pad

,

Thermal Conductive Silicone Pad For LED

6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery

 

TS-TIF®100C 6050-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases. lts flexibility and elasticity make it ideal for covering highly uneven surfaces. With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures,thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.


Features:


>Excellent thermal conductivity6.0W/mK

>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic

>Available in various thicknesses
>Good chemical stability


Applications:

 

>CPU and GPU processors and other chipsets
>High-performance computing (HPC)

>Industrial equipment
>Network communication devices

>New energy vehicles

Typical Properties of  TS-TIF®100C 6050-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 50 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 7.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 6.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.
6.0W High Performance Self-Adhesive Thermal Gap Filler Pad Thermal Conductive Silicone Pad For LED CPU GPU EV Battery 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Independent R&D team

 

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Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)