Factory Customize Thickness And Size Die Cut 8.0W Thermal Gap Filler 0.5mm Conductive Silicone Thermal Pad

The TIF^®700QE Series is a high-end compressible thermal pad engineered to meet top-level cooling requirements while maintaining excellent assembly workmanship. Through an innovative material formulation, it achieves an ideal combination of ultra-high thermal conductivity and moderate hardness. This unique performance balance allows it to efficiently handle the cooling challenges posed by ultra-high heat flux densities, while also providing good mechanical strength and compressibility — making it easy to process and install. It offers a reliable interface material solution with both outstanding thermal performance and high reliability for high-power-density electronic devices.

• Good thermal conductivity: 8.0 W/mK
• Naturally tacky — no further adhesive coating required
• Soft and compressible for low-stress applications
• Available in various thicknesses
• Easy release construction
• Electrically isolating
• High durability

• Heat sinking housing at LED-lit BLU in LCD
• LED TV and LED-lit lamps
• RDRAM memory modules
• Micro heat pipe thermal solutions
• Automotive engine control units
• Telecommunication hardware
• Routers
• Medical devices
• Auditioning electronic products
• Unmanned aerial vehicle (UAV)

• Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
• Standard Size: 16" × 16" (406 mm × 406 mm)

• Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
• Adhesive Options: A1/A2 (Single-sided / Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

With a wide range, good quality, reasonable prices, and stylish designs, Ziitek thermal conductive interface materials are extensively used in mainboards, VGA cards, notebooks, DDR & DDR2 products, CD-ROM, LCD TV, PDP products, server power products, down lamps, spotlights, street lamps, daylight lamps, LED server power products, and others.

Our dedicated in-house research and development team continuously advances material formulations and manufacturing processes to deliver reliable, high-performance thermal management solutions.