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Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap
Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap
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Large Image :  Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF200-02E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Color: Pink Thermal Conductivity: 1.0 W/m-K
Hardness: 35 Shore00 Specific Gravity: 1.75g/cc
Dielectric Constant: 5.5 MHz Continuos Use Temp: -50 To 200℃
High Light:

thermally conductive pad

,

thermal conductive material

,

fiberglass reinforced thermal conductive pad

 

Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

The TIF™240 is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

Features

 

Good thermal conductive
Moldability for complex parts
Soft and compressible for low stress applications
Naturally tacky needing no further adhesive coating
Available in varies thicknesses
Broad range of hardnesses available

 

Applications

 

CPU
display card
mainboard/mother board
notebook
power supply
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics

 

Typical Properties of TIF™240
Product Name TIF™200-U TIF™200-E TIF™200-S Visual Composite Thickness hermal Impedance
@10psi
(℃-in²/W)
Color Various Visual TIF™200-U

TIF™

200-E

TIF™200-S
Construction &
Compostion

Ceramic filled

silicone rubber

*** 12 mils 0.304mm 0.73 0.75 0.76
20 mils 0.508mm 0.95 0.97 0.98
Specific Gravity

1.75g/cc

ASTM D297 30 mils 0.762mm 1.17 1.18 1.20
40 mils 1.016mm 1.28 1.30 1.32
Heat Capacity

1 l/g-K

ASTM C351 50 mils 1.270mm 1.47 1.49 1.52
60 mils 1.524mm 1.68 1.70 1.73
Hardness 15 25 45 ASTM 2240 70 mils 1.778mm 1.86 1.88 1.91
Shore 00 80 mils 2.032mm 2.05 2.08 2.11
Tensile Strength

425 psi

ASTM D412 90 mils 2.286mm 2.21 2.24 2.28
100 mils 2.540mm 2.37 2.40 2.44
Continuos Use Temp -50 to 200℃

***

110 mils 2.794mm 2.49 2.53 2.57
120 mils 3.048mm 2.65 2.69 2.73
Dielectric Breakdown Voltage >5500 VAC ASTM D149 130 mils 3.302mm 2.82 2.86 2.91
140 mils 3.556mm 2.95 3.00 3.05
Dielectric Constant 5.5 MHz ASTM D150 150 mils 3.810mm 3.08 3.12 3.17
160 mils 4.064mm 3.20 3.25 3.30
Volume Resistivity 4.0X10"
Ohm-meter
ASTM D257 170 mils 4.318mm 3.34 3.39 3.44
180 mils 4.572mm 3.44 3.49 3.55
Fire rating 94 V0 equivalent UL 190 mils 4.826mm 3.52 3.57 3.63
200 mils 5.080mm 3.62 3.68 3.73
Thermal conductivity 1.0 W/m-K ASTM D5470 Visua l ASTMD751 ASTM D5470
 
 
Standard Thicknesses:           
0.0040" (1mm) 
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
 
 
Fiberglass Reinforced Thermal Conductive Pad TIF240 1mm T For Filling Air Gap 0
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)