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Product Details:
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| Name: | Two Component Silicone Thermally Conductive Potting Compound For Gluing Metal And PCB | Keywords: | Thermally Conductive Potting Compound |
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| Components: | Two Component | Continuous Use Temp: | -45 To 200℃ |
| Packing: | 1kg/can | Thermal Conductivity: | 1.0 W/m-K |
| Hardness(Shore 00): | 65 | Density(g/cm³): | 1.73 |
| Highlight: | thermally conductive adhesives,acrylic based adhesive,1.0W/mK Thermal Conductive Potting Compound |
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| Uncured Material Properties | ||
|---|---|---|
| Construction | Ceremic-filled silicone | - |
| Color/Part A | White | Visual |
| Color/Part B | Black | Visual |
| Part A Viscosity (mPa.s) | 3500 | GB/T 10247 |
| Part B Viscosity (mPa.s) | 3500 | GB/T 10247 |
| Mix Ratio | 1:1 | - |
| Shelf life (months) | 6 (Unopened) | - |
| Cure Schedule | ||
| Pot Life @25℃ | 30 mins | Ziitek Test Method |
| Cure @25℃ | 3 hours | Ziitek Test Method |
| Cure @70℃ | 20 mins | Ziitek Test Method |
| Cure Material Properties | ||
| Color | Gray White | Visual |
| Hardness (Shore 00) | 65 | ASTM D2240 |
| Density (g/cm³) | 1.73 | ASTM D792 |
| Recommended Operating temperature (℃) | -45 ~200 | - |
| Flame Rating | V-0 | UL 94 |
| Thermal Conductivity (W/mK) | 1.0 | ASTM D5470 |
| Breakdown Voltage (V/mm) | ≥7000 | ASTM D149 |
| Dielectric Constant @1MHz | 4.2 | ASTM D150 |
| Volume Resistivity (Ohm*cm) | >1.0x10¹² | ASTM D257 |
Contact Person: Dana Dai
Tel: +86 18153789196