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varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK

varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK
varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF120-15-12U
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Color: Sapphire Blue Volume Resistivity: 4.0X10" Ohm-meter
Dielectric Breakdown Voltage: >10000 VAC Dielectric Constant: 5.5 MHz
Continuos Use Temp: -50 To 200℃
High Light:

thermal conductive material

,

cpu thermal pad

varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK

 

  The TIF120-15-12U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.


Features:


>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

 
Typical Properties of TIF120-15-12U Series
Color

Sapphire Blue

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
27/35/45/60
(Shore 00)
ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp

-50 to 200℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
varies thickness blue Thermally Conductive pad Silicone Gap Filler thermal conductive materials Ultra Soft 1.5 W/mK 1
 

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Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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