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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

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Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

China Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W supplier
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W supplier Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W supplier Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W supplier Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W supplier

Large Image :  Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™803Y series

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: Phase Changing Materials Color: Yellow
Thermal Conductivity: 0.95 W/mK Density: 2.2g/cc
Temperature Range: -25℃~125℃

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W

 

The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

 

The TIC™803Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.

 

Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W


Features:

 

No heat sink preheating required
Low thermal resistance
Ease of use for high volume manufacturing
High thixotropic index
Dry to the touch for pre-apply applications
High thermal reliability, minimal pump out
Re-flow compatible
Cost Effective
Used where electrical isolation is not required
Low volatility – less than 1%
Easy to handle in the manufacturing environment
Flows but doesn’t run like grease
Available in custom die-cut shapes, kiss-cut on rolls

 

Applications:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication

 

Typical Properties of TIC™800Y Series
Product Name TICTM803Y TICTM805Y TICTM808Y TICTM810Y Testing standards
Color Yellow Yellow Yellow Yellow Visual
Composite Thickness

 

0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance ±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density 2.2g/cc Helium Pycnometer
Work temperature -25℃~125℃  
phase transition temperature 50℃~60℃  
Setting temperature 70℃ for 5 minutes  
Thermal conductivity 0.95 W/mK ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa) 0.021℃-in²/W 0.024℃-in²/W 0.053℃-in²/W 0.080℃-in²/W ASTM D5470 (modified)
0.14℃-cm²/W 0.15℃-cm²/W 0.34℃-cm²/W 0.52℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.
 
Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with  0.024℃-in² / W

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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