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0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change Materials T725P For IGBTs

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change Materials T725P For IGBTs

0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change Materials T725P For IGBTs
0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change Materials T725P For IGBTs
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Large Image :  0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change Materials T725P For IGBTs

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: T725P
Payment & Shipping Terms:
Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Product Name: Phase Changing Materials Color: Pink
Thermal Conductivity: 0.95 W/mK Product: T725P
Temperature Range: -25℃~125℃ Thickness: 0.127mmT
High Light:

thermal insulating materials

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heat sensitive materials

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IGBTs Phase Change Materials

0.95 W/mK Chomerics T725 replacing high performance ZIITEK thermal conductive PCM phase change materials T725P For IGBTs

 

T725P series is  low melting point thermal interface material. At 50℃, T725P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.T725P series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

T725P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

 

Applications Include:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 

Features:

 

For Lowest Thermal Resistance :
>  0.014℃-in² /W thermal resistance
>  Naturally tacky at room temperature,
     no adhesive required             
>  No heat sink preheating required

 

                                                  Typical Properties of T725P Series
Product Name TICTM805P  Testing standards
Color Pink Visual
Composite Thickness 0.005"
(0.126mm)
 
Thickness Tolerance ±0.0008"
(±0.019mm)
 
Density 2.2g/cc Helium Pycnometer
Work Temperature -25℃~125℃  
phase transition temperature 50℃~60℃  
Thermal conductivity 0.95 W/mK ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa) 0.024℃-in²/W ASTM D5470 (modified)
0.15℃-cm²/W

 

Standard Thicknesses:


0.005"(0.127mm) 

 

Standard Sizes:


 10" x 16"(254mm x 406mm)       16" X 400'   (406mm X 121.92M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
 
Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

 

0.95 W/mK Chomerics T725 replacing ZIITEK Thermal Conductive PCM Phase Change Materials T725P For IGBTs 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)