Payment & Shipping Terms:
|Product Name:||Phase Changing Materials||Color:||Pink|
|Thermal Conductivity:||0.95 W/mK||Product:||T725P|
0.95 W/mK Chomerics T725 replacing high performance ZIITEK thermal conductive PCM phase change materials T725P For IGBTs
T725P series is low melting point thermal interface material. At 50℃, T725P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.T725P series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
T725P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required
|Typical Properties of T725P Series|
|Product Name||TICTM805P||Testing standards|
|phase transition temperature||50℃~60℃|
|Setting temperature||70℃ for 5 minutes|
|Thermal conductivity||0.95 W/mK||ASTM D5470 (modified)|
|Thermal lmpedance @ 50 psi(345 KPa)||0.024℃-in²/W||ASTM D5470 (modified)|
10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
No reinforcement is necessary.