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Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

China Low Temperature Melting  Phase Changing Materials PCM 5.0 W/mK  T-PCM  T558 Hi-Flow PCS Kenflow supplier
Low Temperature Melting  Phase Changing Materials PCM 5.0 W/mK  T-PCM  T558 Hi-Flow PCS Kenflow supplier Low Temperature Melting  Phase Changing Materials PCM 5.0 W/mK  T-PCM  T558 Hi-Flow PCS Kenflow supplier

Large Image :  Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™808G series

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: Phase Changing Materials (PCM) Color: Gray
Thermal Conductivity: 5.0 W/mK Density: 2.6g/cc
Temperature Range: -25℃~125℃ Thickness: 0.127~0.25mmT

Low Temperature Melting Phase Changing Materials PCM 5.0 W/mK T-PCM T558 Hi-Flow PCS Kenflow

 

TIC™800G series is  low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

 

Applications Include:


> LED Lighting

> Thermal test stands

> DC/DC Converts

> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

> Telecommunication 

 

Features:

 

For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
     no adhesive required             
> No heat sink preheating required

 

Typical Properties of TICTM800G Series
Product Name TICTM805G TICTM808G TICTM810G TICTM812G Test Method
Color Gray Gray Gray Gray Visual
Thickness 0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance  ±0.0008''
(±0.019mm)
±0.0008''
(±0.019mm)
±0.0012''
(±0.030mm)
±0.0012''
(±0.030mm)
 
Density 2.6g/cc Helium Pycnometer
Temperature range -25℃~125℃  
Phase Change Softening Temperature 50℃~60℃  
"Burn In" Temperature 70℃ for 5 minutes  
Thermal Conductivity 5.0 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.014℃-in²/W 0.020℃-in²/W 0.038℃-in²/W 0.058℃-in²/W ASTM D5470 (modified)
0.09℃-cm²/W 0.13℃-cm²/W 0.25℃-cm²/W 0.37℃-cm²/W

 

 

Standard Thicknesses:


0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)        0.0012"(0.305mm)                        
Consult the factory alternate thickness.

 

Standard Sizes:


 10" x 16"(254mm x 406mm)       16" X 400'   (406mm X 121.92M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
 
Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

 

Low Temperature Melting  Phase Changing Materials PCM 5.0 W/mK  T-PCM  T558 Hi-Flow PCS Kenflow

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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