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TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

China TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible supplier
TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible supplier TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible supplier TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible supplier TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible supplier TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible supplier

Large Image :  TIC808A gray Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC808A

Payment & Shipping Terms:

Minimum Order Quantity: 1000PC
Price: USD 0.03PCS
Packaging Details: 1000PCS/bag
Delivery Time: 2-3Works
Supply Ability: 100000PCS/DAY
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Detailed Product Description
Thickness Tolerance: ±0.0008" (±0.019mm) Color: Gray
Thermal Conductivity: 2.5 W/mK Thermal Lmpedance @ 50 Psi(345 KPa)@ 50 Psi(345 KPa): 0.30℃-cm²/W
Work Temperature: -25℃~125℃ Phase Transition Temperature: 50℃~60℃

TIC808A Phase Changing Materials in High Frequency Microprocessors

 

The TIC™800A Series is low melting point thermal interface material. At 50℃, The TIC™800A Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800A Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. 


      The TIC™800A Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. 


 

 

 

Typical Properties of TIC™800A Series
Product Name
TICTM803A
TICTM805A
TICTM808A
TICTM810A
Testing standards
Color
Ashy
Ashy
Ashy
Ashy
Visual
Composite Thickness
0.003"
(0.076mm)
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
 
Thickness Tolerance
±0.0006"
(±0.016mm)
±0.0008"
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
 
Density
2.5g/cc
  Helium   Pycnometer
Work Temperature
-25℃~125℃
 
phase transition  temperature
50℃~60℃
 
Setting temperature
70℃ for 5 minutes
 
Thermal conductivity
2.5 W/mK
ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa)@ 50 psi(345 KPa)
0.018℃-in²/W
0.020℃-in²/W
0.047℃-in²/W
0.072℃-in²/W
ASTM D5470 (modified)
0.11℃-cm²/W
0.13℃-cm²/W
0.30℃-cm²/W
0.46℃-cm²/W
 
 
Standard Thicknesses:

0.003"(0.076mm)          0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)                  
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm)      9" x 400'(228mm x 121M)            
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive: 

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement: 

No reinforcement is necessary.

Features:


> 0.020℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 
TIC808A gray  Low Melting Point Phase Changing Materials For High Frequency Microprocessors 2.5 W/mK Re-flow compatible

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

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