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High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
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High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management

High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management
High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management

Large Image :  High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIG780-50
Document: TIG780-50_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1KG
Price: Negotiation
Packaging Details: 1KG/CAN
Delivery Time: 3-7 work days
Payment Terms: T/T
Supply Ability: 100KG/Days

High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management

Description
Product Name: High Temperature Thermal Grease Silicone Based Thermal Compound For Heat Transfer And Electronic Device Thermal Management Color: Gray
Construction: Ceramic Filled Silicone Thermal Conductivity: 5.0 W/mK
Keywords: Thermal Grease Application: Heat Transfer And Electronic Device Thermal Management
Highlight:

thermally conductive grease

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heat sink grease

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5.0 W/mK high thermal conductivity grease

High Temperature Thermal Grease Silicone Based Thermal Compound
Designed for heat transfer and electronic device thermal management applications requiring both cost efficiency and performance.
Product Overview
TIG®️780-50 is a paste-like thermal interface material specifically designed for heat dissipation of various high and medium power electronic components. Under typical assembly pressure and small filling thickness, the material fully wets the contact surface, effectively eliminates interface air, and forms a continuous heat conduction path. This product is widely used in general electronic equipment cooling scenarios that require both cost and performance, such as network communication, security monitoring, household appliances, and conventional industrial control hardware.
Key Features
  • Low thermal resistance
  • High thermal conductivity
  • Excellent wettability, able to fully wet the contact surface and eliminate air gaps
  • Long operating time, non-toxic and environmentally friendly
Applications
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • LED lighting
  • ASIC chip
  • Interface filling of CPU, GPU, and heat dissipation module
  • Vehicle control unit
Technical Specifications of TIG®780-50 Series
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicone -
Bond Line Thickness (mm) 0.031 -
Density (g/cm³) 2.3 ASTM D792
Viscosity (mPa*s) @25℃ 450000 GB/T 10247
Recommended Operating Temperature (°C) -45~200 -
Thermal Conductivity (W/mK) 5.0 ISO22007
Thermal Impedance (℃.in²/W) @30psi 0.013 ASTM D5470
Volume Resistivity (Ohm*cm) >1.0×10¹³ ASTM D257
Volatility Loss (%) @150℃, 24hrs <0.1 -
TIG 780-50 High Temperature Thermal Grease product image
Our Services
  • Online service: 12 hours, inquiry reply within fastest time
  • Working hours: 8:00am - 5:30pm, Monday to Saturday (UTC+8)
  • Well-trained & experienced staff available to answer all inquiries in English
  • Standard export carton or marked with customer's information or customized packaging
  • Free samples provided
  • After-service support: If products don't work as expected, we provide proof-based solutions and satisfactory resolutions
Frequently Asked Questions
What is Pump-Out in Thermal Grease?
Pump-out refers to the displacement or migration of a TIM from the interface area due to repeated thermal cycling and mechanical stress. Over time, this can increase thermal resistance and reduce thermal performance.
What is Thermal Grease Dry-Out?
During long-term exposure to high temperatures, some thermal greases may experience evaporation, structural changes, or changes in rheological properties. These changes can affect interface contact and thermal performance.
Can Thermal Grease be used for long-term automotive applications?
Yes, but the thermal grease should be specifically designed and validated for automotive environments. Key factors include thermal cycling, vibration, humidity resistance, temperature resistance, and long-term reliability.
Which is better: Thermal Grease or a Thermal Pad?
There is no universal answer. Thermal grease is often suitable for very thin interface layers, while thermal pads may be more appropriate for larger gaps or applications requiring convenient and fast assembly. The best choice depends on the specific application requirements.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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