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Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers

Certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers

Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers
Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF400 Series
Document: TIF400_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 100000pcs/day

Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers

Description
Products Name: Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers Color: Yellow
Thermal Conductivity: 2.0 W/m-K Hardness: 65/45 Shore 00
Density(g/cm³): 2.5 Breakdown Strength (V/mm): ≥5.0
Flame Rating: UL 94 V-0 Keywords: Electrically Insulating Thermal Pad
Application: Thermal Management For Servers
Highlight:

thermally conductive filler

,

thermal conductivity silicone

,

2.0 W/m-K thermal Gap Filler

Electrically Insulating Thermal Pad With 2.0W/MK Thermal Conductivity For Thermal Management For Servers
Product Overview

TIF®400 Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features
  • Good thermal conductive: 2.0 W/mK
  • Naturally tacky needing no further adhesive coating
  • Soft and compressible for low stress applications
  • Available in various thicknesses
Applications
  • Cooling components to the chassis of frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Typical Properties of TIF®480 Series
Property Value Test Method
Color Yellow Visual
Construction Ceramic filled silicone elastomer -
Thickness range (inch/mm) 0.010"~0.020" (0.25~0.50mm) | 0.030"~0.200" (0.75~5.00mm) ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Density (g/cm³) 2.5 ASTM D792
Recommended Operating Temperature (℃) -40-200℃ -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity (Ohm-cm) >1.0×10¹² ASTM D257
Thermal conductivity (W/m-K) 2.0 ASTM D5470 / ISO22007
Flame Rating V-0 UL94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes
  • Reinforcement Fabric: FG (Fiberglass)
  • Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
  • Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF Series Thermal Pad product image showing yellow thermal interface material
Company Profile

Ziitek Electronic Material and Technology Ltd was founded in 2006 and headquartered in Dongguan, Guangdong, is a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. In order to quickly respond to the global customer demand, the company has established production bases in Kunshan, Jiangsu, Taiwan Province and Viet Nam, and continues to promote the global distribution of production areas to ensure efficient delivery and localized services. Zhaoke's product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, and is widely used in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company has passed many certifications such as IATF16949 and ISO9001, and its products meet ROHS, REACH and UL specifications, serving the global market with reliable quality.

Certifications
  • ISO9001:2015
  • ISO14001:2004
  • IATF16949:2016
  • IECQ QC 080000:2017
  • UL
Frequently Asked Questions
Q: What Is a Thermal Pad?
A: A thermal pad is a pre-formed TIM designed to fill gaps between heat sources and heat sinks. Depending on the formulation, thermal pads can also provide electrical insulation and flame resistance.
Q: How Do I Choose the Correct Thermal Pad Thickness?
A: Thermal pad thickness should be selected based on the actual gap, dimensional tolerance, compression ratio and assembly pressure rather than simply choosing the thinnest option.
Q: Can Thermal Pads Be Customized?
A: Yes. ZIITEK can provide customized thermal interface solutions based on thickness, dimensions, shape, hardness and surface requirements.
Q: Does a Thermal Pad Need Compression?
A: Most thermal pads require a controlled amount of compression to improve interface contact. Excessive compression, however, may create unwanted mechanical stress.

Overall Rating

5.0
Based on 50 reviews for this supplier

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All Reviews

D
Dante
Poland Jul 20.2026
These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.
Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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