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1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery

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China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
China Dongguan Ziitek Electronical Material and Technology Co., Ltd certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery

1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery
1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery 1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery 1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery

Large Image :  1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF460
Document: TIF400_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 100000pcs/day

1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery

Description
Features: Good Softness And Fillability Products Name: 1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery
Thermal Conductivity: 2.0W/mK Construction: Ceramic Filled Silicone Elastomer
Hardness: 65/45 Shore 00 Fire Rating: 94-V0
Keywords: High Temperature Thermal Pad Application: Mother Board And Lithium Battery
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1.5mmT Thermal Gap Filler

1.5mm Thickness Thermal Gap Filler High Temperature Thermal Pad For Mother Board And Lithium Battery
Product Overview

TIF®400 Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and ease of use, effectively transferring heat while providing basic physical protection for electronic components.

Key Features
  • Good thermal conductivity: 2.0 W/mK
  • Naturally tacky - no additional adhesive coating required
  • Soft and compressible for low stress applications
  • Available in various thicknesses
Applications
  • Cooling components to chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Technical Specifications of TIF®400 series
Property Value Test Method
Color Yellow Visual
Construction Ceramic filled silicone elastomer -
Thickness range (inch/mm) 0.010"~0.020" (0.25~0.50mm) | 0.030"~0.200" (0.75~5.00mm) ASTM D374
Hardness (Shore 00) 65 | 45 ASTM 2240
Density (g/cm³) 2.5 ASTM D792
Recommended Operating Temperature -40°C to 200°C -
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity (Ohm-cm) >1.0×10¹² ASTM D257
Thermal conductivity (W/m-K) 2.0 ASTM D5470 / ISO22007
Flame Rating V-0 UL94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) to 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16" × 16" (406 mm × 406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF 400 Series Thermal Gap Filler Product Image
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competency in thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offers
  • Quality assurance contracts
Frequently Asked Questions
What is a Thermal Silicone Pad?

A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.

What are the advantages of Thermal Silicone Pads?

Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.

Is a thinner Thermal Silicone Pad always better?

Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

What are the common thicknesses of Thermal Silicone Pads?

Different product series can be available in thicknesses ranging from very thin pads to several millimeters or even thicker options. The appropriate thickness should be determined based on the customer's gap, compression requirements, and assembly structure.

Can Thermal Silicone Pads be customized in size?

Yes. Thermal silicone pads can be customized according to the customer's product structure, including length, width, thickness, and complex shapes. Die-cutting, punching, and other processing methods can also be used to produce customized parts.

Overall Rating

5.0
Based on 50 reviews for this supplier

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All Reviews

D
Dante
Poland Jul 20.2026
These worked so well, I came back for more. I have a mini pc with passive cooling. When it heats up, the case/heat sink separates slightly from the CPU causing the CPU temps to increase drastically. These thermal pads filled the gap giving me consistent CPU temperatures. I also used them for LAN and NVME drives.
Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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