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High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0

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Good quality Thermal Conductive Pad for sales
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High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0

China High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0 supplier
High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0 supplier High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0 supplier High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0 supplier

Large Image :  High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0

Product Details:

Place of Origin: China
Brand Name: ziitek
Certification: RoHs
Model Number: TIS580-12

Payment & Shipping Terms:

Minimum Order Quantity: 25PC
Packaging Details: 300ml/1PC
Delivery Time: 2-3 work days
Supply Ability: 1000PC/Day
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Detailed Product Description
Appearance: White Paste Density(g/cm3,25℃): 1.3
Operation Temperature(℃): -60~250 Thermal Conductivity W/(m·K): 1.2

High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

 

Feature

 
Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance

 
Application
 
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-13, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
 
To potting LED Lighting heat spreader and power- driver.
Ferrite cements
Relay sealant
Power transformers and coils
Adhesion to metal glass and plastic
tip type LED
PCB and plastics
small electrical devices
IGBTS
Transformer
LED Power Supply
LED Controller
LED Lights
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters
Rainproof LED Power Supply
Waterproof LED Power Supply
Piranha wroof and common lED module
 
High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60~250℃ UL94 V-0
 
Typical values of TISTM580-12
AppearanceWhite pasteTest Method
Density(g/cm3,25℃)1.3ASTM D297
Tack-free time(min,25℃)≤20*****
Cure type(1-component)Dealcoholized*****
Viscosity@25℃ Brookfield (Uncured)20K cpsASTM D1084
Total cure time(d, 25℃)3-7*****
Elongation(%)≥150ASTM D412
Hardness(Shore A)25ASTM D2240
Lap Shear Strength(MPa)≥2.0ASTM D1876
Peel Strength(N/mm)>3.5ASTM D1876
Operation temperature(℃)-60~250*****
Volume Resistivity(Ω·cm)2.0×1016ASTM D257
Dielectric Strength(KV/mm)21ASTM D149
Dielectric Constant (1.2MHz)2.9ASTM D150
Thermal Conductivity W/(m·K)1.2ASTM D5470
Flame RetardancyUL94 V-0

E331100

 
 

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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