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Silicone Curing Thermal Conductive Adhesive For LED lighting TIS580-10 Low Shrinkage 45 shoreA Hardness

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Good quality Thermal Conductive Pad for sales
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Silicone Curing Thermal Conductive Adhesive For LED lighting TIS580-10 Low Shrinkage 45 shoreA Hardness

China Silicone Curing Thermal Conductive Adhesive For LED lighting TIS580-10 Low Shrinkage 45 shoreA Hardness supplier
Silicone Curing Thermal Conductive Adhesive For LED lighting TIS580-10 Low Shrinkage 45 shoreA Hardness supplier Silicone Curing Thermal Conductive Adhesive For LED lighting TIS580-10 Low Shrinkage 45 shoreA Hardness supplier

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Product Details:

Place of Origin: China
Brand Name: ziitek
Certification: RoHs
Model Number: TIS580-10

Payment & Shipping Terms:

Minimum Order Quantity: 25PC
Packaging Details: 300ml/1PC
Delivery Time: 2-3 work days
Supply Ability: 1000PC/Day
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Detailed Product Description
Appearance: White Paste Total Cure Time(d, 25℃): 3-7
Tack-free Time(min,25℃): ≤20 Thermal Conductivity W/(m·K): 1.0

Thermal conductive silicone curing adhesive TIS580-10 low shrinkage 45 shoreA hardness for LED lighting

TIS™580-10 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-10 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-10 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

 

Feature

 

>Good thermal conductivity: 1.0W/mK

>Good maneuverability and good adhesion

>Low shrinkage

>Low viscosity, leads to void-free surface

>Good solvent resistance, water resistance

>Longer working life

>Excellent thermal shock resistance

 
Application
 
It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-10, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
 
To potting LED Lighting heat spreader and power- driver.
Ferrite cements
Relay sealant
Power transformers and coils
Adhesion to metal glass and plastic
tip type LED
PCB and plastics
small electrical devices
IGBTS
Transformer
LED Power Supply
LED Controller
LED Lights
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters
Rainproof LED Power Supply
Waterproof LED Power Supply
Piranha wroof and common lED module

 

Typical values of TISTM580-10
Appearance White paste Test Method
Density(g/cm3,25℃) 1.3 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 30K cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥200 ASTM D412
Hardness(Shore A) 45 ASTM D2240
Lap Shear Strength(MPa) ≥2.5 ASTM D1876
Peel Strength(N/mm) >5 ASTM D1876
Operation temperature(℃) -60~250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.0 ASTM D5470
Flame Retardancy UL94 V-0 E331100

 

300ml/1PC

 

Silicone Curing Thermal Conductive Adhesive For LED lighting TIS580-10 Low Shrinkage 45 shoreA Hardness

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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