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One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk

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One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk

China One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk supplier
One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk supplier One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk supplier

Large Image :  One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIE™380-25

Payment & Shipping Terms:

Minimum Order Quantity: 1KG/PC
Packaging Details: 1kg/can
Delivery Time: 2-3 work day
Supply Ability: 100KG
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Detailed Product Description
Thermal Conductivity: 2.5 W/m-K Appearance Cured: Dull Gray Solid
Components: One Component Packing: 1kg/can
Continuous Use Temp: -40 To 180℃ Key Substrates: Metals, Ceramics

Thermal conductive One Component epoxy adhesive TIE380-25 2.5w/mk conductivity for gluing metal and PCB  

 

TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive

 

Product Summary:

 

TIE™380-25 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength. TIE™380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

 

Feature

 

>Good thermal conductivity: 2.5W/mK

>Good maneuverability andadhesion performance

>Low shrinkage

>Low viscosity, easy-to-gas emissions

>Good solvent resistance, water resistance

>Longer working hours

>Excellent resistance to thermal shock

 

Typical Properties of TIETM380-25
Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2800psi *****
Thermal Conductivity 2.5 W/m-K ASTM D5470

 

Application Features:TIE™380-25

 

Color Gray

Viscosity@25 140,000 cPs

Specific Gravity@25 2.1 g/cc

Shelf life @25° 10 Days

@0° 6 Months

(Storage methods and temperature will affect the shelf life)

 

Curing procedures:

Curing temperature Curing time

100° 3 Hours

125 1.5 Hour

150 20 Minutes

170 5 Minutes

 

One Component Epoxy Thermal Conductive Adhesive For Gluing Metal And PCB TIE380-25 2.5w/mk

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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