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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

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PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

China PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors supplier
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors supplier PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors supplier

Large Image :  PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA608P

Payment & Shipping Terms:

Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
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Detailed Product Description
Color: White Backing Type: PET
Continuous Use Temp: -45 °C To 120 °C Thickness: 0.2 Mm
Voltage Breakdown: > 1200 Vac Holding Power (80 °C/Hours): > 48 Hours

Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors

 

 

The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.


Features


>Thermal Conductivity: 0.8 W/mK
>High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
>High performance, thermally conductive acrylic adhesive
>Fire rating equate 94 V0


Applications


>Mount heat sink onto BGA graphic processor or drive processor
>Mount heat spreader onto power converter PCB or onto motor control PCB
>High performance, thermally conductive acrylic adhesive
>Can be used instead of heat cure adhesive,screw mounting or clip mounting

 

Typical Properties of TIA608P Series  
Typical Properties TIA608P  test  
Color White view  
Adhesive Type Acrylic Adhesive **********  
Backing Type PET **********  
 

Continuous

Use Temp

-45 °C to 120 °C **********  
 
Thickness  0.008" 0.203mm  ASTM D374  
 
Voltage Breakdown  > 1200 Vac  ASTM D149  
 
Thermal Conductivity 0.8 W/mK ASTM D5470  
 
180°Peel Adhesion > 1200 g/inch (Steel, Immediate) PSTC-1  
 
180°Peel Adhesion > 1400 g/inch (Steel after 24 hrs) PSTC-1  
 
Holding Power (25 °C/Hours) > 48 Hours PSTC-7  
 
Holding Power (80 °C/Hours) > 48 Hours PSTC-7  
 
Fire rating equate 94 V0 *****
 
 
 

Standard Thicknesses:

0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)

Consult the factory alternate thickness.

 

Standard Sizes:

40" x 100'(1016mm x 30.48M) Individual die cut shapes can be supplied.

 

Reinforcement:

TIA™600P series The coil can be filled with PET.

 
PET Backing Thermal Conductive Adhesive Tape TIA608P For Bonding Heat Microprocessors
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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