Send Message
Home ProductsThermal Adhesive Tape

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

I'm Online Chat Now

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive
video play

Large Image :  Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIA820FG
Payment & Shipping Terms:
Minimum Order Quantity: 10SQM
Packaging Details: 10RL/bag
Delivery Time: 2-3Work day
Supply Ability: 1000SQM/Day
Detailed Product Description
The Thickness Of The: 0.020" 0.508mm The Breakdown Voltage: > 3500 Vac
Thickness Tolerance: ±0.002" ±0.05mm Peel Adhesion: 1200 G/inch2
Thermal Conductivity: 0.8 W/mK Thermal Impedance @ 50 Psi: 1.43℃-in²/W
High Light:

adhesive foam tape

,

acrylic adhesive tape

,

Glass Fiber Backing Thermal Tape

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive

 

The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.

 

TIA800FG Series Datasheet-(E)-REV01.pdf


Features


> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive

 

Applications


> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting

 

Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive 0

 

Typical Properties of TIA™800FG Series
Product Name TIATM805FG TIATM806FG TIATM808FG TIATM810FG TIATM815FG TIATM820FG  Test  Method
Color White Visual
Adhesive Type Acrylic Adhesive ********
Backing Type Glass fiber ********

Composite

Thickness

0.005" 0.127mm 0.006" 0.152mm 0.020" 0.203mm 0.010" 0.254mm 0.015" 0.381mm 0.020" 0.508mm ASTM D374

Aluminum

Foil Thickness

±0.001"  ±0.025mm ±0.001"  ±0.025mm ±0.0012" ±0.03mm ±0.0012" ±0.03mm ±0.0015" ±0.038mm ±0.002"  ±0.05mm

ASTM D374

Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Peel Adhesion 1200 g/inch2 JIS K02378

Holding Power

25℃/Days

> 120 kg/inch2 JIS K023711
Holding Power 120℃/Hours > 10 kg/inch2 JIS K023711

Recommend

Using Pressure

10 psi ********
Thermal Conductivity 0.8 W/mK ********

Thermal

Impedance

@50psi

0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470

 

Standard Thicknesses:      
0.005"(0.127mm)     0.006"(0.152mm)     0.008"(0.203mm)     0.010"(0.254mm)     0.015"(0.381mm)     0.020"(0.508mm)   
Consult the factory alternate thickness.

Standard Sizes: 
10" x 18"(254mm x 457mm)    10" x 400'(254mm x 121.9M) 
Individual die cut shapes can be supplied.

Reinforcement: 
TIA™800 Series sheets are fiberglass reinforced.
 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)