The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!
—— Peter Goolsby
I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials
—— Antonello Sau
Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!
5W / MK UL recognized thermal conductive gap filler 1.5mmT,45 SHORE00 for LED Flesible strip, LED bar The TIF560-50-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The ... Read More
5W / MK, China company supplied heat sink pad 45 shore00 with grey colour For LED TV and LED-lit lamps The TIF5160-50-11US is recommended for applications that require a minimum amount of pressure on components... Read More
ultra soft professional factory thermal gap filler 125 Shore 00 For GPS navigation and other portable devices The TIF1120-05ES is not only designed to take advantage of the gap heat transfer, to fill gaps, ... Read More
Naturally Tacky Rubber Gap Filler Thermally Conductive Interface Materials 3.0 W/MK The TIF150-30-05S thermally conductive interface materials are applied to fill the air gaps between the heating elements and ... Read More
Thermal Gap Filler Heat Conductivity Materials For Cooling Components, 1.5 W/m-K The TIF100-15-16Sthermally conductive interface materials are applied to fill the air gaps between the heating elements and the ... Read More
Heat Dissipation 7W Thermal Conductive Silicone Pad for LED Computer Graphics Card CPU GPU RTX Ziitek TIF7140HZ is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional ... Read More
TIC808A Phase Changing Materials in High Frequency Microprocessors Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal ... Read More
Routers Applied Raw Thermally Conductive Engineer Plastics 1.45g/cm3 Light Weight TCP100-07-02A 0.7W/mK 0.1% shrinkage Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low ... Read More
Cache Chips gray 2.5 W/mK No heat sink preheating required phase changing materials The TIC808A is low melting point thermal interface material. At 50, The TIC800A Series begins to soften and flow, filling the ... Read More
Ethylene Vinyl Acetate Copolymer Resin Adhesive Sponge Foam Material with 72.5% Compaction Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Read More
