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1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance

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1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance

China 1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance supplier
1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance supplier 1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance supplier 1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance supplier

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Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIG780-10

Payment & Shipping Terms:

Minimum Order Quantity: 1KG
Packaging Details: 1KG/CAN
Delivery Time: 3-5 work days
Supply Ability: 100kg/Days
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Detailed Product Description
Product Name: TIG780-10 Color: White
Viscosity: 1000K Cps @.25℃ Specific Gravity: 2.2 G/cm3
Thermal Conductivity: 1.0 W/mK Evaporation: 0.23% / 200℃@24hrs

1W Non Toxic Thermal Grease Conductivity White Safe for LED 0.15 ℃ - in² / W Thermal Resistance

 

 

The TIG™780-10 products are the high-efficiency heat dissipation ones for the fillings between the electronic components and the heat dissipation fins. They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance. Consequently, the heat dissipation efficiency is far superior to that offered by others.

 


Features

 

Low thermal resistance  0.15 ℃-in² /W
One component paste like interface material, never dry
Thermal compound formulated to maximize the heat transfer
Outstanding electrical insulation properties and will not harden on long exposure to elevated temperatures
Non-toxic and environmentally safe
Silicone-based materials conduct heat between a hot component and a heat sink or enclosure
Fills interface variable tolerances in electronics assemblies and heat sink applications
Dispensable, highly conformable materials require no cure cycle, mixing or refrigeration
Thermally stable and require virtually no compressive force to deform under typical assembly pressures
Supports high power applications requiring material with minimum bond line thickness and high conductivity
Ideal for rework and field repair situations
Low bleed and evaporation

 


Applications

 

Semiconductor cases and heat sinks
Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices
CPUs and GPUs
Automatic dispensing and screen-printing
Mobile, desktop
Engine and transmission control modules
Memory modules
Power conversion equipment
Power supplies and UPS
Power semiconductors
Custom ASICS Chips
Integrated Gate Bipolar Transistors (IGBT)
Between any heat generating semiconductor and heat sink
Custom power modules
Telecommunications and automotive electronics

 

 

 

Typical Properties of TIG™780-10 Series
Product Name
TIGTM780-10

 

Tese Method
Color
White paste
Visual
Construction &
Compostion
Metal oxide filled silicone oil
 
Viscosity
1000K cps @.25℃ 
Brookfield RVF,#7 
Specific Gravity
2.2 g/cm3 
 
Continuos Use Temp
-49℉ to 392℉ / -45℃ to 200℃ 
***** 
Evaporation 
0.23%   /  200℃@24hrs
***** 
Thermal Conductivity
1.0 W/mK 
ASTM D5470 
hermalImpedance
0.15℃-in²/W @ 50 psi(344 KPa) 
ASTM D5469 

 

     

 

1W/mK Non Toxic Thermal Conductive Grease White Safe for LED 0.15 ℃ - in² / W Thermal Resistance

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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