Payment & Shipping Terms:
|Product Name:||Phase Changing Materials||Color:||Gray|
|Thermal Conductivity:||5.0 W/mK||Density:||2.6g/cc|
Thermal Phase Changing Low Melting Materials , Heat Sensitive Materials For Notebook
TIC™812G series is low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
no adhesive required
> No heat sink preheating required
|Typical Properties of TICTM812G Series|
|Product Name||TICTM805G||TICTM808G||TICTM810G||TICTM812G||Test Method|
|Phase Change Softening Temperature||50℃~60℃|
|"Burn In" Temperature||70℃ for 5 minutes|
|Thermal Conductivity||5.0 W/mK||ASTM D5470 (modified)|
|Thermal Impedance @ 50 psi(345 KPa)||0.014℃-in²/W||0.020℃-in²/W||0.038℃-in²/W||0.058℃-in²/W||ASTM D5470 (modified)|
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.0012"(0.305mm)
Consult the factory alternate thickness.
10" x 16"(254mm x 406mm) 16" X 400' (406mm X 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
No reinforcement is necessary.