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Product Details:
Payment & Shipping Terms:
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| Heat Capacity: | 1 L/g-K | Thermal Conductivity: | 3.0 W/m-K |
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| Hardness: | 20±5 Shore 00 | Density: | 3.0 G/cc |
| Continuos Use Temp: | -40 To 160℃ | Flame Rating: | 94 V0 |
| High Light: | 20±5 Shore thermal conductivity pad,Mainboard Thermal Conductive Gap Pad,Thermal Conductive Gap Pad 3.0 W/M-K |
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High cost-effective thermal conductive gap pad 20±5 Shore 00,3.0 W/m-K for mainboard/mother board
The TIF1160-30-11US is an extremely soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF1160-30-11US is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
TIF100-30-11US-Series-Datasheet-.pdf
Features
> Good thermal conductive: 3.0 W/mK
>Thickness:4.0mmT
>hardness:20±5 shore00
>Colour: gray
>Fiberglass reinforced for puncture, shear and tear resistance
>Easy release construction
>Electrically isolating
Applications
>Memory Modules
>Mass storage devices
>Automotive electronics
>Set top boxes
>Monitoring the Power Box
>AD-DC Power Adapters
>Rainproof LED Power
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Typical Properties of TIF1160-30-11US Series
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Color
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gray
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Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone rubber
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.0g/cc
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ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
4.0mmT
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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20±5 Shore 00
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ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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Outgassing(TML)
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0.35%
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ASTM E595
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 160℃
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.0 MHz
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ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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1.0X1012
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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3.0 W/m-K
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ASTM D5470
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.
FAQ
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Contact Person: Miss. Dana
Tel: 18153789196
