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Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials

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Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials

China Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials supplier
Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials supplier Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials supplier Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials supplier Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials supplier

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Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™810G series

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: Phase Changing Materials Color: Gray
Thermal Conductivity: 5.0 W/mK Density: 2.6g/cc
Temperature Range: -25℃~125℃ Thickness: 0.127~0.25mmT

Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials

 

 

TIC™810G series is  low melting point thermal interface material. At 50℃, TIC™800G series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.TIC™800G series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

 

Applications Include:


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 

Features:

 

For Lowest Thermal Resistance :
> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature,
     no adhesive required             
> No heat sink preheating required

 

Typical Properties of TICTM810G Series
Product Name TICTM805G TICTM808G TICTM810G TICTM812G Test Method
Color Gray Gray Gray Gray Visual
Thickness 0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance  ±0.0008''
(±0.019mm)
±0.0008''
(±0.019mm)
±0.0012''
(±0.030mm)
±0.0012''
(±0.030mm)
 
Density 2.6g/cc Helium Pycnometer
Temperature range -25℃~125℃  
Phase Change Softening Temperature 50℃~60℃  
"Burn In" Temperature 70℃ for 5 minutes  
Thermal Conductivity 5.0 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi(345 KPa) 0.014℃-in²/W 0.020℃-in²/W 0.038℃-in²/W 0.058℃-in²/W ASTM D5470 (modified)
0.09℃-cm²/W 0.13℃-cm²/W 0.25℃-cm²/W 0.37℃-cm²/W

 

 

Standard Thicknesses:


0.005"(0.127mm)          0.008"(0.203mm)          0.010"(0.254mm)        0.0012"(0.305mm)                        
Consult the factory alternate thickness.

 

Standard Sizes:


 10" x 16"(254mm x 406mm)       16" X 400'   (406mm X 121.92M)              
TIC™800 series are supplied with a white release paper and a bottom liner. TIC800™ series is available in kiss cut an extended pull tab liner or individual die cut shapes.
 
Peressure Sensitive Adhesive:


Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:
No reinforcement is necessary.

 

Notebook Phase Changing Materials , Ultra-Thin Pilot Thermal Heat Absorbing Materials

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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