Product name:Ultra-Soft Thermally Conductive Sheet For Electronic Products Energy Storage Industrial
Density:3.2 g/cm³
Color:Balck
Prodcuts name:Low Thermal Impedance Ultra Soft Thermal Pad For 5G, Aerospace, AI, Electric Vehicle
Thickness:0.010"(0.25mm)~0.200"(5.0mm)
Thermal conductivity:5.0W/m-K
Prodcuts name:Good Thermal Conductivity Silicone-Based Thermal Gap Pad For Electronic Components 5G Aerospace AI
Application:Electronic Components 5G Aerospace AI
Thickness:0.010"(0.25mm)~0.200"(5.0mm)
Prodcuts name:High Performance Hardness 35 Shore OO Thermal Pad For 5G Aerospace AI AIoT AR/VR/MR/XR
Construction & Compostion:Ceramic filled silicone elastomer
Color:Purple
Prodcuts name:Good Insulation Thermally Conductive Silicon Thermal Pad 1.0 W/MK Heat Resistant Thermal Gap Pad
Color:Pink/ Blue
Application:5G, Aerospace, AI, Energy Storage, Industrial, Lighting Equipment
Prodcuts name:Ultra Soft And Good Compressibility Thermally Conductive Gap Filler Pads For 5G Aerospace AI
Application:5G Aerospace AI
Thickness:0.25mm~5.0mm(0.010"~0.200")
Prodcuts name:Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers
Thermal conductivity:5.0W/m-K
Keywords:Thermal GAP PAD Materials
Prodcuts name:Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers
Keywords:Ultra Soft Thermal Pad
Flame Rating:UL 94 V-0
Prodcuts name:Thermal Conductivity Of 3.0W/Mk Ultra Soft Thermal Pad For 5G Aerospace AI AIoT And Automotive
Flame Rating:UL 94 V-0
Hardness:30 Shore 00
Prodcuts name:Low Bleed Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers
Hardness:55 Shore 00
Thermal conductivity:2.8 W/m-K
Product name:High Performance 10.0W Thermal GAP PAD Materials For Al Servers
Keywords:Thermal GAP PAD Materials
Color:Gray
Prodcuts name:High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers
Continuos Use Temp:-40 to 200℃
Dielectric Breakdown Voltage:>5500VAC