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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D
2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

Large Image :  2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIE™ 280-25AB
Payment & Shipping Terms:
Minimum Order Quantity: 2kg/LOT
Packaging Details: 1kg/can
Delivery Time: 2-3 work day
Supply Ability: 1000KG
Detailed Product Description
Hardness @25℃: 85 Shore D Service Temperature: -40℃ To +130℃
Glass Transition Temperature Tg: 92℃ Elongation: 0.10%
Thermal Conductivity: 2.5 W/m-K Dielectric Strength: 300 Volts / Mil
High Light:

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2.5W / mK Thermal Conductive Glue

2.5W / mK Low Viscosity Thermal Conductive Glue with -40℃ - 130℃ Service Temperature

 

 

TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

 

TIE280-25 A&B.pdf

 

 Features     

      

Good thermal conductive: 2.5W/mK

Excellent insulation and smoothly sourface.

Low shrinkage

Low viscosity, expediting air releaseed.

Excellent in solvents and water proof. 

Longer life time.

Excellent thermal shock efficiecy and impact resistance

 

 Application

 

Automotive starters potting; General potting Thermal detector potting

Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

Power transformers and coils; Potting capacitors Potting of small electrical devices

Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

Optical / medical component adhesive


 

Typical Uncured Material TIE™ 280-25A (Resin)  
Color  Black
Viscosity@25℃ Brookfield  3,000 cPs 
Specific Gravity  2.1 g/cc
Shelf life @25℃ in sealed container  12 months 
TIE™ 280-25B (Hardener)
Color  Black
Viscosity@25℃ Brookfield  5,000 cPs 
Shelf life @25℃ in sealed container  12 months n 

 

 

Mix Ratio (By weight)                                                                                                         TIE™ 280-12A : TIE™ 280-12B = 100 : 100  
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃)  45 min
Specific Gravity  2.1g/ccn 
Cure Schedule  
Cure 12 hours at 25℃
Cure 30 minutes at 70℃

 

 

Cured Properties 
Hardness @25℃ 85 Shore D 
Service temperature -40℃ to +130℃
Glass transition temperature Tg   92℃
Elongation 0.10%
Coefficient of thermal expansion, / ℃ 3.0 X 10-5
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ 0.1

 

 

Thermal
Thermal Conductivity  2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength 300 volts / mil 
Dielectric Constant 4.2 MHz 
Dissipation factor 0.029 MHz 
Volume resistivity, ohm-cm @ 25℃ 3.0 X 1012

 

2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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