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Product Details:
Payment & Shipping Terms:
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| Certification: | UL | Name: | Factory Supply Variety Of Thicknesses Thermal Conductive Pad For CPU |
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| Thermal Conductivity: | 7.0 W/m-K | Thickness: | 4.5mmT |
| Material: | Silicone | Applications: | CPU Cooling |
| Keyword: | Thermal Conductive Pad | ||
| High Light: | Variety Thicknesses Thermal Conductive Pad,CPU Conductive Pad,CPU Thermal Conductive Pad |
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Factory Supply Variety of Thicknesses Thermal Conductive Pad for CPU
The TIF7180Z is an extremely soft gap filling material rated at a thermal conductivity of 7.0W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF7180Z is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
TIF700Z-Series-Datasheet(E)-REV01.pdf
Features
> Good thermal conductive: 7.0 W/mK
> Thickness: 4.5mmT
> hardness:55 shore 00
> Colour: Grey
> Easy release construction
> Electrically isolating
> High durability
Applications
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
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Typical Properties of TIF7180Z Series
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Color
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Grey |
Visual
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Composite Thickness
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Thermal Impedance@10psi
(℃-in²/W) |
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Construction &
Compostion |
Ceramic filled silicone elastomer
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***
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10mils / 0.254 mm
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0.16
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20mils / 0.508 mm
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0.20
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Specific gravity |
3.45 g/cc |
ASTM D297
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30mils / 0.762 mm
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0.31
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40mils / 1.016 mm
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0.36
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| Thickness |
4.5mmT
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***
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50mils / 1.270 mm
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0.42
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60mils / 1.524 mm
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0.48
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Hardness
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55 Shore 00 |
ASTM 2240
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70mils / 1.778 mm
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0.53
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80mils / 2.032 mm
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0.63
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| Thermal conductivity |
7.0W/mk
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ASTMD5470
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90mils / 2.286 mm
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0.73
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100mils / 2.540 mm
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0.81
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Continuos Use Temp
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-40 to 200℃
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***
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110mils / 2.794 mm
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0.86
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120mils / 3.048 mm
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0.93
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Dielectric Breakdown Voltage
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>5500 VAC
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ASTM D149
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130mils / 3.302mm
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1.00
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140mils /3.556 mm
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1.08
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Dielectric Constant
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4.5MHz |
ASTM D150
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150mils / 3.810 mm
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1.13
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160mils / 4.064 mm
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1.20
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Volume Resistivity
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5.2X1013
Ohm-cm |
ASTM D257
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170mils / 4.318 mm
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1.24
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180mils / 4.572 mm
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1.32
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Fire rating
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94 V0
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equivalent
UL |
190mils / 4.826 mm
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1.41
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200mils / 5.080 mm
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1.52
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Thermal conductivity
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7.0 W/m-K |
GB-T32064
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Visua l/ ASTM D751
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ASTM D5470
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Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Contact Person: Miss. Dana
Tel: 18153789196
