|
Product Details:
Payment & Shipping Terms:
|
| Keyword: | Thermal Gap Pad | Dielectric Constant: | 4.6 MHz |
|---|---|---|---|
| Name: | Specific Gravity 2.7 G/cc Outstanding Thermal Performance Conductive Pads For CPU | Volume Resistivity: | 1.0X1012 Ohm-cm |
| Fire Rating: | 94 V0 | Thickness: | 1.5mmT |
| High Light: | Specific Gravity 2.7g/Cc thermal gap pad,CPU thermal gap pad,1.5mm silicone thermal pad |
||
Specific Gravity 2.7 g/cc Outstanding Thermal Performance Conductive Pads for CPU
The TIF160-20-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TIF100-20-10UF-Datasheet-REV02.pdf
Features
> Good thermal conductive: 2.0 W/mK
>Thickness: 1.5mmT
>hardness:75 shore 00
>Colour: Gray
>Moldability for complex parts
>Outstanding thermal performance
>High tack surface reduces contact resistance
Applications
>Automotive engine control units
>Telecommunication hardware
>Handheld portable electronics
>Semiconductor automated test equipment (ATE)
>CPU
>display card
|
Typical Properties of TIF160-20-10UF Series
|
||||
|
Color
|
gray |
Visual
|
Composite Thickness
|
Thermal Impedance@10psi
(℃-in²/W) |
|
Construction &
Compostion |
Ceramic filled silicone elastomer
|
***
|
10mils / 0.254 mm
|
0.16
|
|
20mils / 0.508 mm
|
0.20
|
|||
|
Specific gravity |
2.7 g/cc |
ASTM D297
|
30mils / 0.762 mm
|
0.31
|
|
40mils / 1.016 mm
|
0.36
|
|||
| Thickness |
1.5mmT
|
***
|
50mils / 1.270 mm
|
0.42
|
|
60mils / 1.524 mm
|
0.48
|
|||
|
Hardness
|
75 Shore 00 |
ASTM 2240
|
70mils / 1.778 mm
|
0.53
|
|
80mils / 2.032 mm
|
0.63
|
|||
| Outgasing (TML) |
0.35%
|
ASTM E595
|
90mils / 2.286 mm
|
0.73
|
|
100mils / 2.540 mm
|
0.81
|
|||
|
Continuos Use Temp
|
-40 to 160℃
|
***
|
110mils / 2.794 mm
|
0.86
|
|
120mils / 3.048 mm
|
0.93
|
|||
|
Dielectric Breakdown Voltage
|
>5500 VAC
|
ASTM D149
|
130mils / 3.302mm
|
1.00
|
|
140mils /3.556 mm
|
1.08
|
|||
|
Dielectric Constant
|
4.6 MHz |
ASTM D150
|
150mils / 3.810 mm
|
1.13
|
|
160mils / 4.064 mm
|
1.20
|
|||
|
Volume Resistivity
|
1.0X1012
Ohm-cm |
ASTM D257
|
170mils / 4.318 mm
|
1.24
|
|
180mils / 4.572 mm
|
1.32
|
|||
|
Fire rating
|
94 V0
|
equivalent
UL |
190mils / 4.826 mm
|
1.41
|
|
200mils / 5.080 mm
|
1.52
|
|||
|
Thermal conductivity
|
2.0 W/m-K
|
ASTM D5470
|
Visua l/ ASTM D751
|
ASTM D5470
|
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ:
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q:Do big buyers have promotional prices?
A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.
Contact Person: Miss. Dana
Tel: 18153789196
