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LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK

Good quality Thermal Conductive Pad for sales
Good quality Thermal Conductive Pad for sales
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LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK

China LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK supplier
LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK supplier LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK supplier LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK supplier LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK supplier

Large Image :  LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: RoHs
Model Number: TIC™810Y

Payment & Shipping Terms:

Minimum Order Quantity: 1000PCS
Price: negotiation
Packaging Details: 1000pcs/bay
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
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Detailed Product Description
Product Name: Phase Changing Materials Color: Yellow
Thermal Conductivity: 0.95 W/mK Density: 2.2g/cc
Temperature Range: -25℃~125℃

LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK​

 

 The TIC™810Y Series is low melting point thermal interface material. At 50℃, The TIC™810Y Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™810Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.

 

 The TIC™810Y Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
 

LED Power Supply Thermal Phase Changing Materials Heatsink Thermal Pad 0.95W/MK

 

Features
>0.024℃-in² /W thermal resistance
>Naturally tacky at room temperature, no adhesive required
>No heat sink preheating required
 

 

Applications

 

High Frequency Microprocessors
Notebook
Computer Serves
Memory Modules
Cache Chips
IGBTs
COB Led
Desktop PCs
CPU
Microprocessors
Chipsets
Graphic Processing Chips
Custom ASICs
Servers
Memory Modules
Power semiconductors
Power conversion modules
LED Power Supply
LED Controller
LED Lights
LED Ceilinglamp
Monitoring the Power Box
AD-DC Power Adapters

 

 

 

Typical Properties of TIC™810Y Series
Product Name TICTM810Y Testing standards
Color Yellow Visual
Composite Thickness

 

0.010"
(0.254mm)
 
Thickness Tolerance ±0.0012"
(±0.030mm)
 
Density 2.2g/cc Helium Pycnometer
Work temperature -25℃~125℃  
phase transition temperature 50℃~60℃  
Setting temperature 70℃ for 5 minutes  
Thermal conductivity 0.95 W/mK ASTM D5470 (modified)
Thermal lmpedance @ 50 psi(345 KPa) 0.080℃-in²/W ASTM D5470 (modified)
0.52℃-cm²/W
 
Standard Thicknesses:

0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm)
Consult the factory alternate thickness.

Standard Sizes:

9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

Peressure Sensitive Adhesive:

Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

Reinforcement:

No reinforcement is necessary.
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

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