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UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices

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Certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
Customer Reviews
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices

UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices
UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices
UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices

Large Image :  UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-20-02U
Document: TIF100-20-02U_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: Negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Payment Terms: T/T
Supply Ability: 10000/day
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UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices

Description
Products Name: UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices Thermal Conductivity& Compostion: 2.0W/m-K
Specific Gravity: 2.7 G/cm³ Thickness: 0.010~0.200"(0.25~5..0mmT)
Color: Gray White Hardness: 65/27 Shore 00
Keywords: Silicone Thermal Pad Application: Mass Storage Devices
Highlight:

thermally conductive pad

,

thermal conductive material

,

2.01 G/Cc Thermal Conductive Materials

UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices


The TIF®100-20-02U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features:

 
> Good thermal conductive:  2 W/mK 

> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)


Typical Properties of TIF®100-20-02U Series
Property Value Test method
Color

Gray white

 Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 2.7 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
0.25~0.50 0.75~5.00
Hardness(Shore 00) 65 27 ASTM 2240
Recommended Operating Temperature (℃) -40 to 200 ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1Mhz 4.5 ASTM D150
Volume Resistivity(Ohm-cm) ＞1.0X1012  ASTM D257
Thermal Conductivity (W/m-K) 2.0 ASTM D5470
2.0 ISO22007
Fire rating V-0 UL 94 (E331100)

Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.


Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

UL Certificated Soft Heat Sinking Thermal Conductive Pad 2.0W/MK Silicone Thermal Pad For Mass Storage Devices 0

Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:


Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


FAQ:


Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.


Q: How long is your delivery time? 

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity. 


Q: Do you provide samples ? is it free or extra cost? 

A: Yes, we could offer samples free of charge.

Tag:

thermal conductive material,

thermally conductive pad,

cpu thermal pad

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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