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Insulation Ultra Soft Thermal Conductive Gap Pad 12 Shore 00 For RDRAM Memory Modules 

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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Insulation Ultra Soft Thermal Conductive Gap Pad 12 Shore 00 For RDRAM Memory Modules 

Insulation Ultra Soft Thermal Conductive Gap Pad 12 Shore 00 For RDRAM Memory Modules 
Insulation Ultra Soft Thermal Conductive Gap Pad 12 Shore 00 For RDRAM Memory Modules 
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Large Image :  Insulation Ultra Soft Thermal Conductive Gap Pad 12 Shore 00 For RDRAM Memory Modules 

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140-30-11ES
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 work days
Supply Ability: 100000pcs/day
Detailed Product Description
Heat Capacity: 1 L/g-K Thermal Conductivity: 3.0 W/m-K
Hardness: 12 Shore 00 Density: 2.9 G/cc
Continuos Use Temp: -40 To 160℃ Flame Rating: 94 V0
High Light:

ultra soft thermal conductivity pad

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RDRAM memory modules thermal pad

,

RDRAM memory modules thermal conductivity pad

insulation and ultra soft thermal conductive gap pad 1.0mmT, 12 Shore 00 for RDRAM memory modules

 

     The TIF140-30-11ES is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF140-30-11ES maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF140-30-11ES features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

 

TIF100-30-11ES-Datasheet-REV02.pdf


Features

> Good thermal conductive: 3.0 W/mK 

>Thickness:1.0mmT

>hardness:12 shore00

>Colour: gray 

>Naturally tacky needing no further adhesive coating

>Moldability for complex parts

>Electrically isolating


Applications

>RDRAM memory modules

>Micro heat pipe thermal solutions

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

 

 

Typical Properties of TIF140-30-11ES Series
Color
 gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

2.9g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
1.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
12 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
2.9 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

 

 

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

 
Insulation Ultra Soft Thermal Conductive Gap Pad 12 Shore 00 For RDRAM Memory Modules  0

FACTORY INFORMATION:

 

Factory Size

5,000-10,000 square meters

 

Factory Country/Region

Building B8, Industry District , Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China

 

Annual Output Value

US$1 Million - US$2.5 Million

 

 

FAQ:

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)