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Product Details:
Payment & Shipping Terms:
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| Specific Gravity: | 2.95g/cc | Color: | Black |
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| Continuous Use Temp: | -45-200 ℃ | Good Thermal Conductive: | 4.5 W/mK |
| High Light: | High Viscosity Thermally Conductive Putty,Black Thermally Conductive Putty,4.5w/mk thermal gap filler |
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High performance high viscosity thermally conductive putty TIF045-01 black gap filler
TIF045-01 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF045-01 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF045-01 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF045-01 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe ,Vihicel enginee controler
>Telecom industry
Feature
>Thermal conductivity: 4.5W/mK
>Soft, very low compression
>Operate automaticly
| TIFTM045-01 Property | |||
| Color | Black | Visual | |
| Construction & Composition | Ceramic filled silicon material | ********** | |
| Viscosity | 4000,000cps | GB/T 10247 | |
| Specific Gravity | 2.95 g/cc | ASTM D297 | |
| Thermal conductivity | 4.5 W/mK | ISO 22007-2 | |
| Thermal diffusivity | 1.651 mm2/s | ISO 22007-2 | |
| Specific heat capacity | 2.7 MJ/m3K | ISO 22007-2 | |
| Continuous Use Temperature | -45 ~200°C | ****** | |
| Dielectric breakdown strength | 200 V/mil | ASTM D149 | |
| Flame Rating | 94V0 | E331100 | |
| Outgassing,%TML | 0.65% | ASTM E595 | |
Package :
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.
Contact Person: sales02
Tel: +8618153789196
