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Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

—— Chris Rogers

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Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking
Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

Large Image :  Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: Zpaster180-20-11F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Products Name: Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking Color: Dark Grey
Thickness: 2mmT Model: Z-paster180-20-11F
Thermal Conductivity: 2 W/mK Dielectric Constant: 5.5 MHz
Keywords: Silicone Free Gap Filler Pad
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Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

 Z-paster180-20-11F is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

 

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Z-Paster100-20-11F Series Datasheet-(E)-REV01.pdf

 

Features

 

>Silicone-free

>ROSH compliance

>Good thermal conductive:2.0 W/mK

>Soft and Compressible for low stress applications

>Available in varies thickness

 

Application

 

>Cooling components to the chassis of frame

>Display card
>Mainboard/mother board
>Notebook
>Power supply
>Heat pipe thermal solutions
>Memory Modules
>Mass storage devices
>Automotive electronics

 

Typical Properties of Z-Paster180-20-11F Series  
Color Dark Gray Visual Dielectric Breakdown Voltage (T= 1mm above) >5000 VAC ASTM D149  
 
Construction Silicone-free The metal oxide fills ********** Dielectric Constant 5.5 MHz ASTM D150  
 
Thermal Conductivity 2.0 W/mK ASTM D5470 Volume Resistivity 6.0X1013 Ohm-meter ASTM D257  
 
Hardness 65 Shore 00 ASTM 2240 Continuous Use Temp – 20 To 125 **********  
 
Specific Gravity 2.68 g/cc ASTM D297 Outgassing (TML) 0.30% ASTM E595  
 
Thickness    2mmT ASTM D374 Flame Rating 94 V-0

equivalent to

 

Standard size 

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

 

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

 

Silicone Free Gap Filler Pad Thermally Conductive Gap Filler For PCB Heat Sinking 0

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)