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Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

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I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

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Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced  For Tablet PC
Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced  For Tablet PC
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Large Image :  Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140FG-05S
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Products Name: Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC Thermal Conductivity: 1.5 W/m-K
Volume Resistivity: 1.0X10¹² Ohm-meter Dielectric Constant: 4.5 MHz
Hardness: 55 Shore00 Keywords: Thermal Gap Filler Pad
Material: Silicone Based With Fiberglass Feinforced Application: Tablet PC ,CPU
Highlight:

1mm thick silicone thermal pad

,

thermal gap filler pad for Tablet

,

fiberglass reinforced thermal conductive pad

Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced For Tablet PC

 

The TIF140FG-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

Features:


>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness

>  RoHS compliant
>  UL recognized
>  Easy release construction


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  CPU
>  Display card
>  Mainboard/mother board
>  Notebook
>  Power supply
>  Heat pipe thermal solutions
>  Memory Modules
>  Mass storage devices

Typical Properties of TIF140FG-05S Series
Property Value Test method
Color Blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 2.3g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM D374
Hardness 27±5 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X1012 ASTM D257
Fire rating 94 V0 UL equivalent
Thermal conductivity 1.5W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:    
16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
TIF™ series sheets type can add with fiberglass reinforced.

Thickness 0.5mm Manufacturer 55 Shore00 Thermal Gap Filler Pad With Fiberglass Reinforced  For Tablet PC 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana Dai

Tel: 18153789196

Send your inquiry directly to us (0 / 3000)