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TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
The Thermal Conductive Pad is looking and working very good. We have no need for other Thermal Conductive Pad now!

—— Peter Goolsby

I had cooperated with Ziitek for 2 years, they provided high quality thermal conductive materials, and delivery in time, recommend their phase change materials

—— Antonello Sau

Good quality, Good service. Your team always give us help and resolving, hope we will be good partner all the time!

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TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00

TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00
TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00
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Large Image :  TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF140FG-05F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thermal Conductivity: 1.5 W/m-K Volume Resistivity: 4.0X10" Ohm-meter
Dielectric Constant: 5.5 MHz Hardness, Shore 00: 55
Product Name: TIF140FG-05S Material: Silicone Based With Fiberglass
High Light:

1mm thick silicone thermal pad

,

thermal gap filler pad for Tablet

,

fiberglass reinforced thermal conductive pad

TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00

 

 

  The TIF140FG-05F The product is a highly efficient thermal insulation material with thermal conductivity. The heat conduction interface material is used to fill the air gap between the heating element and the heat sink or metal substrate. Their flexibility and elasticity make them suitable for coatings on very uneven surfaces. Heat can be transferred from individual components or even the entire printed circuit board to a metal case or heat sink.

 

Ziitek Thermal Conductive Materials & Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.


Features:


>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 
 
 
Typical Properties of TIF140FG-05S Series
Color

Blue

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness
55(Shore 00) ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage
>1500~>5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

Thermal conductivity
1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
TIF™ series sheets type can add with fiberglass reinforced.
 

TIM manufacturer for Tablet PC thermal gap filler pad 1mmT with fiberglass reinforced TIF140FG-05F 55shore00 0

 

Introduction video of Ziitek company and products: https://youtu.be/kMI6E0nXjGk

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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