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Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks

Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks
Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks

Large Image :  Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF180-20-49E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 100000pcs/day
Detailed Product Description
Color: Pink Thermal Conductivity: 2 W/mK
Product Name: TIF180-20-49E Specific Gravity: 2.50 G/cc
Dielectric Constant: 7.5 MHz Continuos Use Temp: -50 To 200℃
High Light:

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Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks

    Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

 The TIF180-20-49E Series  is a high performance and compatible non-silicone material of the thermal conductive interface materials. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:

>  Good thermal conductive: 2 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 

 

Typical Properties of TIF180-20-49E Series
Color
Pink Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
35 Shore 00 ASTM 2240

70mils / 1.778 mm

1.05 

80mils / 2.032 mm

1.15 

Tensile Strength
 

40 psi

ASTM D412

90mils / 2.286 mm

1.25 

100mils / 2.540 mm

1.34 

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.43   

120mils / 3.048 mm

1.52   

Dielectric Breakdown Voltage
10000 VAC ASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
7.5 MHz ASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
7.8X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07 

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14 

200mils / 5.080 mm

2.22 

Thermal conductivity
2 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

 

 

Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:         
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:                     
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:                     
TIF™ series sheets type can add with fiberglass reinforced.
 
Silicone based thermal conductive gap filler pad TIF180-20-49E for aluminum heat sinks 0

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Miss. Dana

Tel: 18153789196

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