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Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00

Telecommunication Hardware  3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00
Telecommunication Hardware  3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00 Telecommunication Hardware  3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00 Telecommunication Hardware  3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00 Telecommunication Hardware  3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00

Large Image :  Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF100-30-02US
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 10000/day
Detailed Product Description
Thickness: Available In Varies Thicknes Thermal Conductivity: 3.0W/m-K
Hardness: 45 Shore 00 Specific Gravity: 2.75 G/cc
Heat Capacity: 1 L /g-K Typical Properties: TIF100-30-02S
High Light:

high temperature phase change materials

,

thermal conductivity silicone

Telecommunication Hardware 3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00

 

The TIF100-30-02US thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 


Features:


>  Good thermal conductive:3.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:


>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 
Typical Properties of TIF100-30-02US Series
Color

gray

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm 0.36
20mils / 0.508 mm 0.41
Specific Gravity
2.61 g/cc ASTM D297

30mils / 0.762 mm

0.47

40mils / 1.016 mm

0.52
Heat Capacity
1 l /g-K ASTM C351

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65

Hardness
18 Shore 00 ASTM 2240

70mils / 1.778 mm

0.72

80mils / 2.032 mm

0.79
Tensile Strength

45 psi

ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.01 

120mils / 3.048 mm

1.09 
Dielectric Breakdown Voltage
>10000 VAC ASTM D149

130mils / 3.302mm

1.17

140mils / 3.556 mm

1.24
Dielectric Constant
5.5 MHz ASTM D150

150mils / 3.810 mm

1.34

160mils / 4.064 mm

1.42
Volume Resistivity
7.8X10" Ohm-meter ASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

1.60
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.68

200mils / 5.080 mm

1.77
Thermal conductivity
3.0 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:   
           
TIF™ series sheets type can add with fiberglass reinforced.
Telecommunication Hardware  3.0W/m-K Thermal Gap Fillers Materials With High Thermal Conductivity 45 shore00 0
 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

 

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

TIF100-30-02US Datasheet-REV02.pdf

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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