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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module
Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF050-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000tube
Price: negotiation
Packaging Details: 600cc/tube
Delivery Time: 7-15work days
Supply Ability: 10000/day
Detailed Product Description
Specific Gravity: 3.05g/cc Thermal Diffusivity: 1.695mm2/s
Fire Rating: 94-V0 Color: Grey
Outgassing(TML): 0.6% Good Thermal Conductive: 5 W/mK
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Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module

 

TIF050-11 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF050-11 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.

TIF050-11 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF050-11 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

 

Application

 

>Heat-sink & frame

>LED backlight module,LED lighting

>High speed hardware driver

>Micro heat pipe ,Vihicel enginee controler

>Telecom industry

> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics

 

Feature

 

>Thermal conductivity: 5W/mK

>Soft, very low compression

>Operate automaticly

>Soft and Compressible for low stress applications

 
TIFTM050-11 Property
Color Gray Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 2000,000cps GB/T 10247
Specific Gravity 3.05 g/cc ASTM D297
Thermal conductivity 5.0 W/mK ISO 22007-2
Thermal diffusivity 1.695 mm2/s ISO 22007-2
Specific heat capacity 2.3 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.60% ASTM E595
 

 

Package :

 

•30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

 

 

Stability Silicone Thermal Gap Filler 3.05g/cc Grey Putty -45-200 ℃ 94-V0 For LED Backlight Module 0

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

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