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Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00

China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00

Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing  60 Shore 00
Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing  60 Shore 00
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Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™100-25-10F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5 days
Supply Ability: 10000pcs/day
Detailed Product Description
Color: Grey Thermal Conductivity: 2.5 W/m-K
Hardness: 60 Shore 00 Specific Gravity: 2.50 G/cc
Dielectric Breakdown Voltage: >10000 VAC Fire Rating: 94-V0
High Light:

thermally conductive filler

,

high temperature phase change materials

Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing 60 Shore 00
 
 
  The TIF™100-25-10F thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
 
Features:
>  Good thermal conductive: 2.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness
Applications:
>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

 
Typical Properties of TIF™100-25-10F Series
Color

Gray

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.57

20mils / 0.508 mm

0.71

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.88

40mils / 1.016 mm

0.96

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.11

60mils / 1.524 mm

1.26

Hardness
60 Shore 00ASTM 2240

70mils / 1.778 mm

1.39 

80mils / 2.032 mm

1.54 

Tensile Strength  

48 psi

ASTM D412

90mils / 2.286 mm

1.66 

100mils / 2.540 mm

1.78

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.87   

120mils / 3.048 mm

1.99   

Dielectric Breakdown Voltage>10000 VACASTM D149

130mils / 3.302mm

2.12

140mils / 3.556 mm

2.22

Dielectric Constant
10.2 MHzASTM D150

150mils / 3.810 mm

2.31

160mils / 4.064 mm

2.41

Volume Resistivity7.3X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.51

180mils / 4.572 mm

2.58

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.64 

200mils / 5.080 mm

2.72

Thermal conductivity
2.5 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
 
Standard Thicknesses:           

0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:    
     
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:      
               
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:     
          
TIF™ series sheets type can add with fiberglass reinforced.
 
Grey 2.5 W / mK Compressible Conductive Heatsink Thermal Gap Filler With Adhesive Backing  60 Shore 00 0
 
FAQ:
 

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
 
 
Our services
 
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
 
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)