Product Details:
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Products Name: | Gray 7.0W Ultra-High Thermal Conductive Silicone Gel For Telecom Industry | Specific Gravity: | 3.50g/cc |
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Color: | Gray | Recommended Operating Temp: | -45-200 ℃ |
Good Thermal Conductive: | 7.0W/mK | Keywords: | Thermal Conductive Silicone Gel |
Construction & Composition: | Ceramic Filler Silicone Material | Application: | Telecom Industry |
Highlight: | Continuous Thermal Conductive Silicone Putty,7.0W Thermal Conductive Silicone Putty,Gray Thermal Conductive Silicone Putty |
Gray 7.0W Ultra-High Thermal Conductive Silicone Gel For Telecom Industry
TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®070-11 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular silicon chips, LED lighting, and other high-power electronic components.
Feature
>Thermal conductivity
>Soft, very low compression
>Low thermal inpedance
>Operate automaticly
>Proven long-term reliability
Application
>Heat-sink & frame
>LED backlight module,LED lighting
>High speed hardware driver
>Micro heat pipe
>Vihicel enginee controler
>Telecom industry
>Semiconductor 'automatic laboratory equipment.
TIF®070-11 Typical Properties | ||
Property | Value | Test method |
Color | Gray | Visual |
Construction & Composition | Ceramic filled silicon material | - |
Flow Rate(g/min) | 30 | Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi) |
Density(g/cc) | 3.50g/c | ASTM D297 |
Thermal conductivity | 7.0W/mK | ASTM D5470 |
Thermal Impedance @10psi (℃.in²w) | 0.142 | ASTM D5470 |
Thermal Impedance @50psi (℃.in²w) | 0.12 | ASTM D5470 |
Recommended Operating Temp | -45 ~200°C | Ziitek Test Method |
Dielectric Strength(V/mm) | ≥4000 | ASTM D149 |
Bond Line Thickness(mm) | 0.2 | Ziitek Test Mothod |
Flame Rating | V-0 | UL 94 |
Shelf Life | 12 months | - |
30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box
We offer the custom packaged in syringes for automated despensing applications.
Please contact us for confirming.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Contact Person: Dana Dai
Tel: 18153789196