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CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad 45 Shore 00 TIF160-20-27E

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certification
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CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad 45 Shore 00 TIF160-20-27E

CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad 45 Shore 00 TIF160-20-27E
CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad 45 Shore 00 TIF160-20-27E
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Large Image :  CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad 45 Shore 00 TIF160-20-27E

Product Details:
Place of Origin: China
Brand Name: ZIITEK
Certification: UL and RoHs
Model Number: TIF™160-27E
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: negotiation
Packaging Details: 1000pcs/bag
Delivery Time: 3-5work days
Supply Ability: 100000pcs/day
Detailed Product Description
Color: Faint Yellow Thermal Conductivity: 2 W/mK
Hardness: 45 Shore 00 Specific Gravity: 2.13 G/cc
Product Name: TIF™160-20-27E Fire Rating: 94-V0
High Light:

2 W/mK thermally conductive gap filler pads

,

cpu cooling thermal conductive silicone pad

,

thermally conductive gap pad for notebook

CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad TIF160-20-27E

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

  The TIF™160-20-27E is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling

 


Features:

 

High tack surface reduces contact resistance 2 W/mK
RoHS compliant
UL recognized

 

 

Applications:

 

CPU
display card
mainboard/mother board
notebook
power supply
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
 
Typical Properties of TIF™160-20-27E
Color

Faint Yellow

Visual Composite Thickness hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
*** 10mils / 0.254 mm

0.57

20mils / 0.508 mm

0.71

Specific Gravity

2.13 g/cc

ASTM D297

30mils / 0.762 mm

0.88

40mils / 1.016 mm

0.96

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.11

60mils / 1.524 mm

1.26

Hardness
45 Shore 00 ASTM 2240

70mils / 1.778 mm

1.39 

80mils / 2.032 mm

1.54 

Tensile Strength  

48 psi

ASTM D412

90mils / 2.286 mm

1.66 

100mils / 2.540 mm

1.78

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.87   

120mils / 3.048 mm

1.99   

Dielectric Breakdown Voltage >10000 VAC ASTM D149

130mils / 3.302mm

2.12

140mils / 3.556 mm

2.22

Dielectric Constant
10.2 MHz ASTM D150

150mils / 3.810 mm

2.31

160mils / 4.064 mm

2.41

Volume Resistivity 7.3X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.51

180mils / 4.572 mm

2.58

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.64 

200mils / 5.080 mm

2.72

Thermal conductivity
2 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470
 
Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)       0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)       0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)       0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness
.

Standard Sheets Sizes:     
    
8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 

Peressure Sensitive Adhesive:   
                 
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:    
           
TIF™ series sheets type can add with fiberglass reinforced.
 
CPU GPU Copper Heatsink 2W/mK Thermal Conductive Silicone Laptop Cooling Pad 45 Shore 00 TIF160-20-27E 0
 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contact Person: Dana

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)